A kind of annealing process of tft substrate glass and tft substrate glass prepared by the same

An annealing process and substrate technology, applied in the field of TFT substrate glass, can solve the problems of inability to realize TFT substrate glass, small reheat shrinkage rate, etc., and achieve the effects of reducing the maximum stress value, improving the annealing quality, and reducing the reheat shrinkage rate

Active Publication Date: 2022-07-22
BEIJING UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a TFT substrate glass annealing process and the TFT substrate glass prepared by it, which solves the problem that the prior art cannot realize the smaller reheat shrinkage rate of the TFT substrate glass

Method used

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  • A kind of annealing process of tft substrate glass and tft substrate glass prepared by the same
  • A kind of annealing process of tft substrate glass and tft substrate glass prepared by the same
  • A kind of annealing process of tft substrate glass and tft substrate glass prepared by the same

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Effect test

Embodiment 1

[0046] After taking the OLED display TFT substrate glass with a thickness of 0.4mm and forming it by the overflow method, it is annealed by the annealing process of the present invention. The specific process is as follows:

[0047] During the heat preservation stage, The temperature is 40℃ / s, the length of the holding section of the annealing furnace is 800mm, and the annealing time for the formed substrate glass is 8s;

[0048] During the slow cooling stage, the temperature range T m is 400℃, slow cooling cooling rate V m is 49.43℃ / s, the glass plate running speed V in the slow cooling section of the annealing furnace 0 is 100mm / s, and the length of the slow cooling section of the annealing furnace is L m is 809mm;

[0049] In the fast cooling stage, the temperature range T k is 300℃, fast cooling cooling rate V k is 197.73℃ / s, the glass plate running speed V in the fast cooling section of the annealing furnace 1 is 100mm / s, and the length of the fast cooling section...

Embodiment 2

[0051] After taking the OLED display TFT substrate glass with a thickness of 0.5mm and forming it by the overflow method, annealing is performed by the annealing process of the present invention. The specific process is as follows:

[0052] During the heat preservation stage, The temperature is 50°C / s, the length of the holding section of the annealing furnace is 1000mm, and the annealing time for the formed substrate glass is 10s;

[0053] In the slow cooling stage, the temperature range T m is 400℃, slow cooling cooling rate V m is 33.08℃ / s, the glass plate running speed V in the slow cooling section of the annealing furnace 0 is 100mm / s, and the length of the slow cooling section of the annealing furnace is L m is 1209mm;

[0054] In the fast cooling stage, the temperature range T k is 300℃, fast cooling cooling rate V k is 132.32℃ / s, the glass plate running speed V in the fast cooling section of the annealing furnace 1 is 100mm / s, and the length of the fast cooling...

Embodiment 3

[0056] After the OLED display TFT substrate glass with a thickness of 0.6 mm is formed by the overflow method, it is annealed by the annealing process of the present invention. The specific process is as follows:

[0057] During the heat preservation stage, The temperature is 60℃ / s, the length of the holding section of the annealing furnace is 1200mm, and the annealing time for the formed substrate glass is 12s;

[0058] During the slow cooling stage, the temperature range T m is 400℃, slow cooling cooling rate V m is 23.83℃ / s, the glass plate running speed V in the slow cooling section of the annealing furnace 0 is 100mm / s, and the length of the slow cooling section of the annealing furnace is L m is 1679mm;

[0059] In the fast cooling stage, the temperature range T k is 300℃, fast cooling cooling rate V k is 95.30℃ / s, the glass plate running speed V in the fast cooling section of the annealing furnace 1 is 100mm / s, and the length of the fast cooling section of the a...

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Abstract

The invention belongs to the technical field of TFT substrate glass processing, and specifically discloses a TFT substrate glass annealing process based on a cooling and shaping rate, which forms a theoretical basis for the processing parameters of the existing three stages: heat preservation stage, slow cooling stage and fast cooling stage , provides data support for the annealing process, and provides great convenience for the industry. After the annealing process of the present invention is adopted, the annealing quality of the TFT substrate glass produced by the overflow method is greatly improved, the reheat shrinkage rate and the maximum stress value are reduced by more than 75%, and the reheat shrinkage rate of the TFT substrate glass for OLED display is 5- 8ppm, the reheat shrinkage rate of the TFT substrate glass for LCD display is 24-45ppm, and the maximum stress on the surface of the TFT substrate glass is 30-60PSI.

Description

technical field [0001] The invention belongs to the technical field of TFT substrate glass processing, and specifically discloses a TFT substrate glass annealing process and a TFT substrate glass prepared by using the same. Background technique [0002] The production of substrate glass is formed by rapid cooling and shaping of glass melt. During the cooling and shaping process, the particle deviates from the equilibrium position, which will generate large thermal stress. However, the annealing furnace is relatively short, and the substrate glass is not fully annealed, resulting in thermal shrinkage. Often as high as tens of ppm (the ratio of shrinkage to original length), or even hundreds of ppm, it is impossible to achieve high-resolution LCD and OLED display products requiring that the reheat shrinkage rate of the substrate glass be less than 10ppm. [0003] The overflow method is a very important process in the production of TFT substrate glass. Seventy-five percent of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B25/00
CPCC03B25/00
Inventor 田英良李淼赵志永王答成王为徐剑
Owner BEIJING UNIV OF TECH
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