Hub type dicing blade, preparation method thereof and application of hub type dicing blade in gallium arsenide material processing

A gallium arsenide, wheel hub technology, applied in the field of processing tools, can solve the problems of slow growth of single crystals, weak mechanical strength of materials, and high prices

Active Publication Date: 2021-05-04
赛尔科技(如东)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Of course, gallium arsenide materials also have some disadvantages, such as: high melting point and vapor pressure of materials, difficult control of components, slow growth rate of single crystal, weak mechanical strength of materials, poor integrity and high price, etc., which greatly affect its application degree

Method used

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  • Hub type dicing blade, preparation method thereof and application of hub type dicing blade in gallium arsenide material processing
  • Hub type dicing blade, preparation method thereof and application of hub type dicing blade in gallium arsenide material processing
  • Hub type dicing blade, preparation method thereof and application of hub type dicing blade in gallium arsenide material processing

Examples

Experimental program
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Effect test

Embodiment 1

[0032] Put the commercially available aluminum alloy substrate in the grinding jig, and perform grinding with stainless steel grinding disc and damping polishing cloth in sequence on the existing grinding machine. ) water dispersion, the concentration is 200g / L, the grinding time is 10min; the pressure of the damping polishing cloth (HSL / Hua Shili) is 10kg when grinding, and the grinding fluid is aluminum alloy polishing fluid (polishing fluid manufacturer: Haide Precision Aluminum Alloy Polishing Fluid, Diluted with water at a mass ratio of 1:2), drip 15ml of grinding liquid on the damping polishing cloth every minute, the grinding time is 15min, and finally wash with water and dry; get the ground aluminum alloy substrate, see the attached picture for the physical picture figure 1 , the diameter of the inner hole is 19.0542~19.055mm, that is, the roundness of the inner hole is 0.8 μm, and the roundness of the inner hole of the prepared hub-type dicing knife is less than 1 μm. ...

Embodiment

[0082] In Example 1, no shedding, snake cutting and knife breaking occurred; in Comparative Example 1, snake cutting occurred after 100 meters and the knife broke after cutting 300 meters; in Comparative Example 2, the knife broke after cutting 560 meters; in Comparative Example 3, the cutting was good in the early stage, 665 meters Edge chipping occurred, and cracking occurred at 730 meters; the blade of comparative example 4 was not broken, but the gallium arsenide wafer was obviously cracked; the blade of comparative example 5 was not broken, and there was no snake cutting, but at 835 meters, the gallium arsenide material collapsed; comparative example The six blades were not broken, and there was no snake cutting, but at 818 meters, the gallium arsenide material collapsed.

[0083] The hub-type scribing knife of the present invention (Example 1) has good processing performance, and the GaAs material after processing has no cracking, see the attached Figure 5 ; The gallium...

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Abstract

The invention discloses a hub type dicing blade, a preparation method thereof and application of the hub type dicing blade in gallium arsenide material processing. An aluminum alloy matrix is subjected to chemical treatment after being ground, and then is put into diamond electroplating liquid for electroplating, and an electroplated blade is obtained; the electroplated blade is subjected to outer circle finishing and lathe machining, then chemical exposure is carried out, then polishing is carried out, and the hub type dicing blade is obtained; and the diamond electroplating liquid is composed of diamond, nickel sulphamate, cobalt sulphamate, nickel sulfate, boric acid and water. The invention discloses the novel dicing blade which is ultrathin, the thickness of the dicing blade is 10-15 microns, and the dispersity of grinding materials is good; and when gallium arsenide materials are processed, a notch is narrow, no crack exists, and the cutting film entering rate is low.

Description

technical field [0001] The invention belongs to the technology of processing tools, and in particular relates to a wheel-hub type scribing knife, a preparation method thereof and an application in gallium arsenide material processing. Background technique [0002] With the rapid development of the semiconductor industry in recent years, various new semiconductor materials have emerged, and gallium arsenide material is one of them. Gallium arsenide material (GaAs) has a high electron mobility (about 5.7 times that of silicon material) and a wide bandgap structure compared with traditional silicon materials. Under the same conditions, it can conduct current faster. We can use gallium arsenide semiconductor materials to prepare microwave devices, which play a key role in satellite data transmission, mobile communication, GPS global navigation and other fields. Of course, gallium arsenide materials also have some disadvantages, such as high melting point and vapor pressure, di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/00C25D3/56C25D5/44B28D5/02
CPCC25D15/00C25D3/562C25D5/44B28D5/022
Inventor 陈昱刘学民李威冉隆光
Owner 赛尔科技(如东)有限公司
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