Small-outer-diameter grooved copper pipe and production method thereof

Abstract

The invention relates to the technical field of heat pipes, in particular to a small-outer-diameter grooved copper pipe and a production method thereof. The small-outer-diameter grooved copper pipe comprises a copper pipe body, the inner wall of the copper pipe body is provided with a plurality of grooves in the circumferential direction, and the grooves are spirally formed in the length direction of the copper pipe body. According to the small-outer-diameter grooved copper pipe and the production method thereof, a high-speed liquid-filled spinning method and a multi-tooth core head are adopted to make metal on the inner wall of a copper pipe base pipe subjected to continuous plastic forming to form the micro grooves. Under the pressure action of the multi-tooth core head and a spinning ball, the metal on the inner wall surface is subjected to plastic deformation after complex plastic flow, so that the final inner wall surface micro grooves are formed. By optimizing the tooth profile design of the drawing core head, the bottom width of grooved pipe internal teeth is reduced, the number of the groove internal teeth is increased, and therefore the small-outer-diameter multi-groove copper pipe for heat pipes is obtained.

Description

technical field [0001] The invention relates to the technical field of heat pipes, in particular to a small-diameter grooved copper pipe and a production method thereof. Background technique [0002] With the continuous progress of society, heat pipes have been widely used in various industries. The heat pipe is a heat transfer element with good thermal conductivity. Its working principle is phase change heat transfer. The basic process is: the working fluid is heated and evaporated into steam in the evaporation section of the heat pipe, and the steam flows to the condensation section through the vacuum channel. In the condensation section, the steam The latent heat is released to condense into a liquid, and the condensed liquid flows back to the evaporation section through the capillary core, and so on. With the increasing cost pressure of grooved heat pipes and the sharp increase of chip heat flux in the microelectronics field and the emergence of new features and new phe...

AI Technical Summary

Problems solved by technology

With the increasing cost pressure of grooved heat pipes and the sharp increase of chip heat flux in the microelectronics field and the emergence of new features and new phenomena such as increasingly narrow effective heat dissipation space, the traditional method of heat dissipation by increasing the effective heat dissipation area can no longer meet the requirements of heat dissipation. need

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