Flux-cored aluminum brazing filler metal and preparation method thereof
A technology of aluminum brazing material and flux core, which is applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of lack of universal applicability, high melting point of pure metal powder, affecting the performance of brazing joints, etc., and achieve good fluidity , Brazing temperature is low, and the effect of improving the strength of the brazing seam
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Embodiment 1
[0036] This embodiment discloses a flux-cored aluminum solder, which includes a flux core and an aluminum-based solder. The specific mass fractions of each substance are shown in Table 1; the aluminum-based solder wraps the flux core;
[0037] The preparation method of Chinese herbal cored aluminum solder in the present embodiment comprises the following steps:
[0038] Step 1, take respectively Si powder, Al-Cu alloy powder (containing 30% Cu), Al-Ge alloy powder (containing 50% Ge), Al-Zn alloy powder (containing 90% Ge) of corresponding quality in proportion Zn), AlF 3 Powder, CsF powder, KF powder, dry for subsequent use; The particle diameter of silicon powder is 100 to 120nm in the present embodiment;
[0039] Mix the powder evenly to obtain the target flux core;
[0040] Step 2. Roll the solder strip into a tubular structure with a spiral joint, and add flux core powder into the tubular structure during the rolling process; the aluminum-based solder includes the follo...
Embodiment 2
[0044] The main differences between this embodiment and Embodiment 1 are shown in Table 1.
[0045] Al-Cu alloy powder (containing 30% Cu), Al-Ge alloy powder (containing 50% Ge), Al-Zn alloy powder (containing 90% Zn); the particle diameter of silicon powder is 100% in the present embodiment to 120nm.
[0046] The aluminum-based solder includes the following substances by mass percentage: 4% Si, and the balance of Al.
Embodiment 3
[0048] The main differences between this embodiment and Embodiment 1 are shown in Table 1.
[0049] Al-Cu alloy powder (containing 35% Cu), Al-Ge alloy powder (containing 55% Ge), Al-Zn alloy powder (containing 97% Zn); the particle diameter of silicon powder is 90% in the present embodiment to 110nm.
[0050] The aluminum-based solder includes the following substances by mass percentage: 4% Si, and the balance of Al.
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