Special aluminum alloy mixed micro-channel liquid cooling plate with efficient heat dissipation

A technology of aluminum alloy and channel liquid, which is applied in the direction of modification by conduction heat transfer, cooling/ventilation/heating transformation, electrical components, etc., which can solve the problem of poor temperature consistency, pump power limitation, and the cooling capacity of microchannel cold plate needs to be improved, etc. question

Active Publication Date: 2021-04-02
WEST ANHUI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the heat dissipation capacity of the micro-channel cold plate still needs to be improved, the temperature consistency is poor, and the pump power is limited.

Method used

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  • Special aluminum alloy mixed micro-channel liquid cooling plate with efficient heat dissipation
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  • Special aluminum alloy mixed micro-channel liquid cooling plate with efficient heat dissipation

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Embodiment Construction

[0033] The technical solution of this patent will be further described in detail below in conjunction with specific embodiments.

[0034] Embodiments of the present patent are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are only used for explaining the patent, and should not be construed as limiting the patent.

[0035] In the description of this patent, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientation or positional relationship indicated by "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this patent and simplifying the des...

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Abstract

The invention provides a special aluminum alloy mixed micro-channel liquid cooling plate with efficient heat dissipation, belongs to the technical field of electronic heat dissipation, and is used forsolving the problems that aluminum alloy liquid cooling plates are low in heat dissipation efficiency and do not have a confluence adjusting mechanism. The cooling plate comprises an upper splicing plate and a lower splicing plate which are tightly attached and fixed, the upper splicing plate and the lower splicing plate are fixedly connected through countersunk head screws, flow guide groove nets with the same depth are arranged on the upper splicing plate and the lower splicing plate, the two flow guide groove nets are spliced to form a working medium flow channel, each flow guide groove net comprises a heat dissipation groove, a spoiler block is arranged at the liquid inlet end of the heat dissipation groove, a confluence block is arranged at the liquid outlet end of the heat dissipation groove, a plurality of capillary tubes at equal intervals are arranged between the spoiler block and the confluence block, and a plurality of flow adjusting valves are arranged on the upper splicing plate. The channel is multiple in branches, short in span, uniform in distribution, consistent in temperature, smooth in flowing, small in flow resistance and high in heat dissipation efficiency; and flow can be distributed through cooperation of the flow adjusting valves and screw holes, local flow resistance is effectively changed, a heat conduction column conducts heat quickly, and the cool speed is high.

Description

technical field [0001] The invention belongs to the technical field of electronic heat dissipation, and relates to an aluminum alloy liquid-cooled cold plate, in particular to a special aluminum alloy mixed microchannel liquid-cooled cold plate with high heat dissipation. Background technique [0002] The miniaturization trend of electronic devices is constantly urging the rapid development of microelectronics technology, and heat dissipation is very important; the current heat dissipation technology mostly adopts natural air cooling or forced air cooling. However, the poor heat dissipation efficiency has been unable to meet its heat dissipation requirements. [0003] Micro-channel cooling technology has excellent heat dissipation performance, is convenient for high-level integration, and can quickly and efficiently remove the heat generated by the heating module. Combined with the development trend of antenna miniaturization and high assembly density, micro-channel cooling ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20254H05K7/20272H05K7/20281H05K7/2039
Inventor 吴军荣秦海波夏松王洪新沙美妤刘建树周宇张晓飞葛干
Owner WEST ANHUI UNIV
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