Heat-conducting polymer composite material with multi-layer continuous network structure and preparation method

A technology of network structure and composite materials, which is applied in the field of heat-conducting polymer composite materials and its preparation, can solve the problems of single three-dimensional continuous heat-conducting network structure, heat transfer, and large average distance, and achieve simple and easy-to-obtain raw materials, high thermal conductivity, and average small distance effect

Active Publication Date: 2021-03-30
济南英维新材料科技合伙企业(有限合伙)
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Existing research has made a series of progress in the construction of three-dimensional continuous heat conduction network and the improvement of thermal conductivity of composite materials. However, the existing three-dimensional continuous heat conduction network has a single structure, and the average distance between the network skeleton and the polymer matrix is ​​large, which is not conducive to heat conduction. The filler exerts its own high thermal conductivity
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Method used

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  • Heat-conducting polymer composite material with multi-layer continuous network structure and preparation method
  • Heat-conducting polymer composite material with multi-layer continuous network structure and preparation method
  • Heat-conducting polymer composite material with multi-layer continuous network structure and preparation method

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Experimental program
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Embodiment 1

[0036] Such as figure 1 As shown, a method for preparing a thermally conductive polymer composite with a multi-level continuous network structure comprises the following steps:

[0037]Prepare a network C, which is a polyurethane network with a pore diameter of 150 μm. Carry out the loading method on the network C 50 times, each loading method is: immerse in the dispersion A for 30 minutes, take it out and dry it at a temperature of 20°C for 0.5 hours to obtain the network C loaded with thermally conductive fillers, immerse the network C loaded with thermally conductive fillers solution B for 30 minutes, take it out and centrifuge at 2000r / min for 30 minutes, and dry at 20°C for 300 minutes to obtain a thermally conductive polymer composite material, wherein,

[0038] The preparation method of dispersion A is as follows: disperse the thermal conductive filler in liquid D to obtain a mixture, and use a cell pulverizer to ultrasonically treat the mixture for 60 minutes to obtai...

Embodiment 2

[0056] A method for preparing a thermally conductive polymer composite material with a multi-level continuous network structure, comprising the following steps:

[0057] Prepare a network C, which is a melamine network with a pore size of 100 μm. Carry out the loading method on the network C 50 times, each loading method is: immerse in the dispersion A for 1 minute, take it out and dry it at a temperature of 50°C for 1 hour to obtain the network C loaded with thermally conductive fillers, and immerse the network C loaded with thermally conductive fillers into the solution In B for 20 minutes, take it out and centrifuge at 1000r / min for 15 minutes, and dry at 50°C for 200 minutes to obtain a thermally conductive polymer composite material, wherein,

[0058] The preparation method of dispersion A is as follows: disperse the thermally conductive filler in liquid D to obtain a mixture, and use a cell pulverizer to ultrasonically treat the mixture for 5 minutes to obtain dispersion...

Embodiment 3

[0062] A method for preparing a thermally conductive polymer composite material with a multi-level continuous network structure, comprising the following steps:

[0063] Prepare a network C, which is a cellulose network with a pore size of 50 μm. Carry out the loading method on the network C 50 times, each loading method is: immerse in the dispersion A for 10 minutes, take it out and dry it at a temperature of 50°C for 3 hours to obtain the network C loaded with thermally conductive fillers, and immerse the network C loaded with thermally conductive fillers into the solution In B for 1min, take it out and centrifuge at 500r / min for 15min, and dry at 50°C for 30min to obtain a thermally conductive polymer composite material, wherein,

[0064] The preparation method of dispersion A is as follows: disperse the thermally conductive filler in liquid D to obtain a mixture, and use a cell pulverizer to ultrasonically treat the mixture for 30 minutes to obtain dispersion A. The power ...

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Abstract

The invention discloses a heat-conducting polymer composite material with multi-layer continuous network structure and a preparation method. The preparation method comprises the following steps: preparing a network C, and loading the network C for 2-50 times, wherein each loading method comprises the following steps: immersing the network C in a dispersion liquid A, taking out the network C, drying the network C at 20-200 DEG C to obtain a network C loaded with a heat-conducting filler, immersing the network C loaded with the heat-conducting filler in a solution B, taking out the network C, conducting drying at 20-320 DEG C for 30-300 min, so as to obtain the heat-conducting polymer composite material. According to the preparation method disclosed by the invention, the required raw materials are simple and easy to obtain, the heat-conducting filler can form a multi-layer three-dimensional continuous heat-conducting network through a simple impregnation process, and the heat-conductingpolymer composite materials with different heat-conducting properties can be obtained by controlling the loading times. The average distance between the polymer matrix of the obtained heat-conductingpolymer composite material and the heat-conducting filler network is relatively small, and the heat conductivity coefficient is relatively high.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and specifically relates to a heat-conducting polymer composite material with a multi-level continuous network structure and a preparation method. Background technique [0002] With the rapid development of 5G communications, highly integrated chips, artificial intelligence, etc., the power density and heat production of electronic devices have increased significantly. If there is no sufficient thermal management guarantee, it will easily lead to premature aging or damage of related devices. Traditional metal heat-conducting materials (such as aluminum, copper, etc.) have been difficult due to limitations such as high density, low specific thermal conductivity (ratio of thermal conductivity to material volume density), high thermal expansion coefficient, and easy oxidation. To meet the current growing demand for heat dissipation. Polymer composite materials based on thermally c...

Claims

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Application Information

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IPC IPC(8): C08J9/42C08L75/04C08L29/04C08K3/04C08L61/28C08L71/02C08L1/02C08K7/00C08K3/08C08L79/08C08L23/12C08K3/38C08L33/02C08L79/02C08K7/24C08K3/28C08L83/04C08L63/00C08J3/21C09K5/14
CPCC08J9/42C08J3/215C08J3/212C09K5/14C08J2375/04C08K3/041C08J2429/04C08J2361/28C08J2471/02C08J2301/02C08J2401/02C08K7/00C08K2003/0806C08J2379/08C08J2479/08C08K3/042C08J2323/12C08J2433/02C08K2003/385C08K7/24C08K2003/0862C08J2379/02C08K3/04C08K3/28C08K3/046C08J2483/04C08K2003/085C08J2363/00
Inventor 秦盟盟陈莉
Owner 济南英维新材料科技合伙企业(有限合伙)
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