Heat-conducting polymer composite material with multi-layer continuous network structure and preparation method

Abstract

The invention discloses a heat-conducting polymer composite material with multi-layer continuous network structure and a preparation method. The preparation method comprises the following steps: preparing a network C, and loading the network C for 2-50 times, wherein each loading method comprises the following steps: immersing the network C in a dispersion liquid A, taking out the network C, drying the network C at 20-200 DEG C to obtain a network C loaded with a heat-conducting filler, immersing the network C loaded with the heat-conducting filler in a solution B, taking out the network C, conducting drying at 20-320 DEG C for 30-300 min, so as to obtain the heat-conducting polymer composite material. According to the preparation method disclosed by the invention, the required raw materials are simple and easy to obtain, the heat-conducting filler can form a multi-layer three-dimensional continuous heat-conducting network through a simple impregnation process, and the heat-conductingpolymer composite materials with different heat-conducting properties can be obtained by controlling the loading times. The average distance between the polymer matrix of the obtained heat-conductingpolymer composite material and the heat-conducting filler network is relatively small, and the heat conductivity coefficient is relatively high.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and specifically relates to a heat-conducting polymer composite material with a multi-level continuous network structure and a preparation method. Background technique [0002] With the rapid development of 5G communications, highly integrated chips, artificial intelligence, etc., the power density and heat production of electronic devices have increased significantly. If there is no sufficient thermal management guarantee, it will easily lead to premature aging or damage of related devices. Traditional metal heat-conducting materials (such as aluminum, copper, etc.) have been difficult due to limitations such as high density, low specific thermal conductivity (ratio of thermal conductivity to material volume density), high thermal expansion coefficient, and easy oxidation. To meet the current growing demand for heat dissipation. Polymer composite materials based on thermally c...

AI Technical Summary

Problems solved by technology

Existing research has made a series of progress in the construction of three-dimensional continuous heat conduction network and the improvement of thermal conductivity of composite materials. However, the existing three-dimensional continuous heat conduction network has a single structure, and the average distance between the network skeleton and the polymer matrix is ​​large, which is not conducive to heat conduction. The filler exerts its own high thermal conductivity

For example, Lin et al. used graphene network to enhance the thermal conductivity of epoxy resin, in which the mass fraction of graphene reached 5%, and the thermal conductivity of the composite material was 1.52W / mK, which was far lower than the theoretical thermal conductivity of graphene of 5300W / mK. This is because the distance between the graphene thermal network and the polymer matrix is ​​too large, and it is difficult for heat to quickly transfer from the polymer matrix to the thermal network.

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