Thermally conductive polymer composite material with multi-level continuous network structure and preparation method

Abstract

The invention discloses a thermally conductive polymer composite material with a multi-level continuous network structure and a preparation method. A network C is prepared, and the network C is loaded for 2 to 50 times. After taking out, it is dried at a temperature of 20 to 200 ° C to obtain a network C loaded with thermally conductive fillers, and the network C loaded with thermal conductive fillers is immersed in solution B. After taking out, it is dried at a temperature of 20 to 320 ° C for 30 to 300 minutes to obtain high thermal conductivity. Molecular composite material, the raw materials required by the preparation method of the present invention are simple and easy to obtain, through a simple impregnation process, the thermally conductive filler can form a multi-level three-dimensional continuous thermally conductive network, and by controlling the number of loads, high thermal conductivity with different thermal conductivity can be obtained. Molecular composites. The average distance between the polymer matrix of the thermally conductive polymer composite and the thermally conductive filler network is small, and the thermal conductivity is high.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and in particular relates to a heat-conducting polymer composite material with a multi-level continuous network structure and a preparation method. Background technique [0002] With the rapid development of 5G communication, high-integration chips, artificial intelligence, etc., the power density and heat production of electronic devices have greatly increased. If there is no sufficient thermal management guarantee, it is easy to cause premature aging or damage of related devices. Traditional metal thermal conductive materials (such as aluminum, copper, etc.) have been difficult to achieve due to the limitations of high density, low specific thermal conductivity (ratio of thermal conductivity to material bulk density), high thermal expansion coefficient, and easy oxidation. To meet the current growing demand for cooling. Polymer composites reinforced with thermally conductive ...

AI Technical Summary

Problems solved by technology

Existing research has made a series of progress in the construction of three-dimensional continuous heat conduction network and the improvement of thermal conductivity of composite materials. However, the existing three-dimensional continuous heat conduction network has a single structure, and the average distance between the network skeleton and the polymer matrix is ​​large, which is not conducive to heat conduction. The filler exerts its own high thermal conductivity

For example, Lin et al. used graphene network to enhance the thermal conductivity of epoxy resin, in which the mass fraction of graphene reached 5%, and the thermal conductivity of the composite material was 1.52W / mK, which was far lower than the theoretical thermal conductivity of graphene of 5300W / mK. This is because the distance between the graphene thermal network and the polymer matrix is ​​too large, and it is difficult for heat to quickly transfer from the polymer matrix to the thermal network.

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