Automatic adhesive tape packaging method for FOSB assembly line

Abstract

The invention discloses an automatic adhesive tape packaging method for an FOSB assembly line. The automatic adhesive tape packaging method specifically comprises the following steps that an adhesivetape head is conveyed into an adhesive tape penetrating channel through the cooperation of the rotation of the adhesive tape penetrating channel and the rotation of the adhesive tape head in the step1; and an adhesive tape head cylinder is taken to push an adhesive tape head push plate to press the adhesive tape head on the inner side wall of the adhesive tape penetrating channel; a pressing block cylinder pushes an adhesive tape pressing block to move forwards to press an adhesive tape onto a wafer packaging box; meanwhile, the adhesive head push plate is loosened, a workpiece supporting rotary conveying device drives the wafer packaging box to rotate to start adhesive tape winding work; after winding is completed, an adhesive tape rotation driving device rotates to straighten the adhesive tape extending section and send the adhesive tape extending section into the adhesive tape penetrating channel, the adhesive tape head is pressed on the inner side wall of the adhesive tape penetrating channel through the adhesive tape head push plate, a blade cylinder pushes a shear blade to shear off the adhesive tape, and one-time adhesive tape winding process is completed. According to theautomatic adhesive tape packaging method for the FOSB assembly line, automatic adhesive tape winding work of wafer packaging box packaging bags can be achieved, the adhesive tape winding efficiency ishigh, the whole process is fully automatically carried out, and the labor cost is reduced.

Description

technical field [0001] The invention relates to the field of wafer packaging box packaging, and more specifically, relates to an automatic tape packaging method of a FOSB assembly line. Background technique [0002] Wafer refers to a silicon chip made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A wafer is a carrier used in the production of integrated circuits. A wafer in the general sense basically refers to It is a single crystal silicon wafer. The single crystal silicon wafer is refined from ordinary silicon sand. After being dissolved, purified, and distilled, it supports a single crystal silicon rod. After the single crystal silicon rod is polished and sliced, it becomes a wafer. With the continuous development of integrated circuit manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnection layers is increasing, and the diameter of the wafer is also increasin...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that the process of wrapping tape on the surface of the packaging bag of the existing wafer packaging box is not highly automated and the tape head is difficult to find. It proposes an automatic tape packaging method for the FOSB assembly line, which can automatically realize wafer packaging. The tape winding work on the surface of the packaging bag of the box has high work efficiency, and it can automatically find the tape head, which is convenient for the entire tape winding work.

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