Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for improving electroplating hole filling process of circuit board

A technology for electroplating and filling holes and circuit boards. It is used in printed circuits, printed circuit manufacturing, electrical components and other directions. It can solve the problems of inability to fill holes with resin and the thinning process of grinding plates, and it is difficult to fill holes in the whole board, and achieve excellent hole filling. Effect, prevent filling holes, simple and easy-to-control effects

Inactive Publication Date: 2021-02-26
东莞市科佳电路有限公司
View PDF12 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development trend of thinner and shorter circuit boards, the substrates of some existing circuit board products are too thin to carry out the resin plug hole plus grinding plate thinning process. They can only drill through holes and fill the whole board. However, direct mechanical drilling is used. Holes and laser drilled through holes are difficult to fill the entire board. Therefore, it is necessary to provide a method that can not only process through holes but also fill holes to improve the above situation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for improving electroplating hole filling process of circuit board
  • Method for improving electroplating hole filling process of circuit board
  • Method for improving electroplating hole filling process of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A method for improving the electroplating hole filling process of a circuit board, comprising the steps of:

[0040] (1) Get the circuit board substrate 11 to be drilled, and use laser processing to drill the first hole 12 on the front of the circuit board substrate 11 and drill the second hole 13 in the corresponding circuit board substrate 11 back area; the first hole 12 communicate with the second channel 13 to form a through hole, and obtain a circuit board substrate 11 drilled with a through hole;

[0041] (2) Carry out copper electroplating and hole filling on the circuit board substrate 11 drilled with through holes.

[0042] Such as figure 1 As shown, in the step (1), the communication between the first channel 12 and the second channel 13 is funnel-shaped, and the thin ends of the first channel 12 and the second channel 13 are connected.

[0043] Further, in the step (1), the aperture of the opening of the first channel 12 located on the front of the circuit ...

Embodiment 2

[0053] A method for improving the electroplating hole filling process of a circuit board, comprising the steps of:

[0054] (1) Get the circuit board substrate 11 to be drilled, and use laser processing to drill the first hole 12 on the front of the circuit board substrate 11 and drill the second hole 13 in the corresponding circuit board substrate 11 back area; the first hole 12 communicate with the second channel 13 to form a through hole, and obtain a circuit board substrate 11 drilled with a through hole;

[0055] (2) Carry out copper electroplating and hole filling on the circuit board substrate 11 drilled with through holes.

[0056] Further, in the step (1), the communication between the first channel 12 and the second channel 13 is funnel-shaped, and the thin ends of the first channel 12 and the second channel 13 are connected. The invention adjusts the parameters of the laser drilling, adjusts the parameters of the laser drilling, makes the through hole form a funnel...

Embodiment 3

[0068] A method for improving the electroplating hole filling process of a circuit board, comprising the steps of:

[0069] (1) Get the circuit board substrate 11 to be drilled, and use laser processing to drill the first hole 12 on the front of the circuit board substrate 11 and drill the second hole 13 in the corresponding circuit board substrate 11 back area; the first hole 12 communicate with the second channel 13 to form a through hole, and obtain a circuit board substrate 11 drilled with a through hole;

[0070] (2) Carry out copper electroplating and hole filling on the circuit board substrate 11 drilled with through holes.

[0071] Further, in the step (1), the communication between the first channel 12 and the second channel 13 is funnel-shaped, and the thin ends of the first channel 12 and the second channel 13 are connected. The invention adjusts the parameters of the laser drilling, adjusts the parameters of the laser drilling, makes the through hole form a funnel...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
pore sizeaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of circuit boards, and in particular, relates to a method for improving an electroplating hole filling process of a circuit board, wherein the method comprises the following steps: (1) taking a circuit board substrate to be drilled, and drilling a first hole channel in the front surface of the circuit board substrate and a second hole channel in a backsurface area of the corresponding circuit board substrate by adopting laser processing; and communicating the first hole passage and the second hole passage to form a through hole; and (2) carrying out electrocoppering hole filling on the circuit board substrate drilled with the through hole. Laser drilling is carried out on the front face and the back face of the circuit board substrate at the same time, the through hole is formed after the holes drilled in the front face and the back face of the circuit board substrate are communicated, and the thin circuit board substrate can be used for machining the through hole and can also be used for hole filling. The method is simple and easy to operate and control, high in production efficiency and low in production cost, a plating layer on the surface of the substrate is uniform after the holes are filled with the electroplated metal, the quality problem of an etched circuit is avoided, and the product yield, the product reliability and theproduction efficiency of the circuit board are improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for improving the electroplating and filling process of circuit boards. Background technique [0002] The circuit board is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. It plays a very important role in modern industrial production. With the development trend of light, thin and short circuit boards, the substrates of some existing circuit board products are too thin to carry out the process of resin plugging and grinding plate thinning. They can only drill through holes and fill the whole board. However, direct mechanical drilling is used. Holes and laser drilled through holes are difficult to fill the entire board. Therefore, it is necessary to provide a method that can not only process through holes but also fill holes to improve the above situation. Contents of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42C25D3/38C25D7/00
CPCH05K3/0026H05K3/421C25D3/38C25D7/00
Inventor 廖发盆徐承升陈军民夏军王海平
Owner 东莞市科佳电路有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com