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SMT chip mounter for circuit board production

A placement machine and circuit board technology, which is applied in the direction of assembling printed circuits, electrical components, electrical components, etc., can solve problems such as gaps and air bubbles, affect the quality of placement, and the circuit board is easy to adhere to dust, etc., to prevent The generation of gaps and air bubbles, the effect of ensuring the adhesion effect

Pending Publication Date: 2021-02-23
苏州昶恒电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the production process of circuit boards, placement machines are needed for placement, but the existing placement machines have defects. On the one hand, the circuit boards are easy to adhere to dust during the transmission process, which affects the quality of placement. On the other hand, placement After completion, it is easy to produce gaps and bubbles, which cannot be solved well

Method used

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  • SMT chip mounter for circuit board production
  • SMT chip mounter for circuit board production
  • SMT chip mounter for circuit board production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as figure 1 , figure 2 , image 3 , Figure 4 As shown, the present invention provides a technical solution: a SMT placement machine for circuit board production, including a dust removal mechanism 1, a working mechanism 2, and the dust removal mechanism 1 includes a slide rail 101, an electric slider 102, a support frame 103, and a slide rail 101 is equipped with an electric slider 102, the upper end of the electric slider 102 is provided with a support frame 103, the support frame 103 is provided with a collection box 104, the collection box 104 is used to collect dust conveniently, and a dust removal mechanism is installed on one side of the collection box 104; Working mechanism 2 comprises conveying frame 201, conveying belt 202, No. 1 motor 203, and conveying frame 201 inner side is equipped with conveying belt 202, and conveying belt 202 is in order to convey circuit board, conveying frame 201 front portion is installed No. 1 motor 203, No. 1 motor 203 sid...

Embodiment 2

[0030] Such as Figure 5 As shown, the difference between Embodiment 2 and Embodiment 1 is that the dust removal mechanism includes a support 105, a No. 1 electric telescopic column 106, and an electrostatic adsorption rod 108. A No. 1 electric telescopic column 106 is installed inside the support 105, and the lower end of the No. 1 electric telescopic column 106 is An electrostatic adsorption bar 108 is installed.

[0031] The electrostatic precipitator net 107 is replaced by an electrostatic adsorption rod 108, which also plays the role of dust removal.

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Abstract

The invention discloses an SMT chip mounter for circuit board production. The SMT chip mounter comprises a dust removal mechanism and a working mechanism. The dust removal mechanism comprises a sliding rail, an electric sliding block and a supporting frame. The electric sliding block is installed on the sliding rail, the supporting frame is arranged on the upper end surface of the electric slidingblock, and a collection box is arranged on the supporting frame. The dust removal mechanism is mounted on one side of the collecting box; and the working mechanism comprises a conveying frame, a conveying belt and a first motor, the conveying belt is installed on the inner side of the conveying frame, a first motor is installed on the front portion of the conveying frame, and a second electric telescopic column is installed on one side of the first motor. The SMT chip mounter is simple in structure, reasonable in design and low in production cost, dust on the circuit board can be removed, attached patches are rolled at the same time, gaps and bubbles are prevented from being generated, and the attaching effect of the patches is greatly guaranteed.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to an SMT placement machine for circuit board production. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. [0003] In the production process of circuit boards, placement machines are needed for placement, but the existing placement machines have defects. On the one hand, the circuit boards are easy to adhere to dust during the transmission process, which a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K13/04
CPCH05K3/30H05K13/0456
Inventor 朱海波
Owner 苏州昶恒电子科技有限公司
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