Thickness-adjustable high-thermal-conductivity graphene heat dissipation film and preparation method thereof

A heat-conducting graphite and graphene film technology, applied in the direction of graphene, chemical instruments and methods, heat exchange materials, etc., can solve the problems of large power consumption, restrictions on the commercial application of graphene heat dissipation film, and high cost. wide range of effects

Active Publication Date: 2021-02-23
安徽今海汉烯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the graphene oxide slurry used in the graphene oxide film has one of the biggest disadvantages, that is, it has high viscosity at low solid content, and when the solid content reaches 2%, the viscosity can reach more than 10mPa·s. Take graphene heat dissipation film as an example, the thickness of graphene oxide film is required to be 300 microns, and the coating thickness of 2% graphene oxide slurry needs to be 1500 mm, of which 98% is water. Such a high thickness consumes a lot of power. , while affecting production efficiency
Therefore, the coating thickness and drying time required for the preparation of the coating and drying method result in high power consumption, low efficiency, and high cost.
Seriously restricting the commercial application of graphene heat dissipation film

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0028] A method for preparing a heat-dissipating graphene film with adjustable thickness and high thermal conductivity, comprising the following steps:

[0029] Step 1. Mix 4-15 parts by mass of graphene oxide into 84-95.9 parts by mass of deionized water, mix, stir and disperse, and mix in 0.1-1 parts by mass of graphene oxide after the preliminary stirring viscosity of the mixture rises to 10,000 mPa·s. Then continue to stir to make the dopant disperse evenly and reduce the viscosity of the system to below 1000mPa·s, then stir and disperse further. After the dispersion is completed, adjust the pH value of the mixture to above 7, and stir until the viscosity of the slurry rises to 3mPa·s Above, the graphene oxide slurry is prepared;

[0030] Step 2. Coating and drying the graphene oxide slurry prepared in the previous step to form a film by coating to form a graphene oxide film with a thickness of 15-2500 μm;

[0031] Step 3. Pretreat the graphene oxide film prepared in the ...

Embodiment approach

[0037] As an embodiment, the metal oxide is any one or a mixture of titanium dioxide, calcium oxide and iron oxide.

[0038] As an embodiment, the alkaline substance is any one or a mixture of ammonia water, sodium hydroxide and ammonium chloride.

[0039] As an embodiment, the coating method is any one or a combination of blade coating, flat coating, roller coating and transfer coating.

[0040] As an embodiment, the calendering method is any one or a combination of rolling, flat pressing and static pressing.

[0041] The heat-conducting graphene cooling film with adjustable thickness is prepared by the above method.

Embodiment 1

[0043]Weigh 4% graphene oxide by weight percentage, 95.9% deionized water and mix and stir initially, when the viscosity reaches above 10,000 mPa S, add 0.1% titanium dioxide, mix and stir, the viscosity is reduced to below 1000 mPa S, stir After the dispersion is uniform, ammonia water is slowly added until the viscosity of the system reaches 100,000 mPa·S, and a graphene oxide film with a thickness of 300 microns is prepared by the scraping method, and then the carbon-oxygen ratio of the graphene oxide film is raised to 4 or more, put the treated graphene oxide film into a high-temperature graphite furnace, under the protection of argon, heat up to 2800°C for graphitization, and obtain a slightly expanded graphene heat dissipation film after full graphitization, and then use a roller The press is rolled to a graphene heat dissipation film with a density of 2g / cm3 and a thickness of 100 microns, and the thermal conductivity can reach 1280w / m·k.

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Abstract

The invention relates to a thickness-adjustable high-thermal-conductivity graphene heat dissipation film and a preparation method thereof. Hydrogen bonds between graphene oxide are destroyed by addinga doping agent, and the viscosity of a system is reduced, so that graphene oxide slurry with high solid content (4-15%) can be prepared, dispersion and stirring are facilitated by reducing the viscosity, and after uniform dispersion, through addition of an alkali, hydrogen bonds of graphene oxide in a system under alkalinity are partially recovered, the viscosity is increased, and stirring is stopped when the viscosity is increased to a required value, thereby obtaining graphene oxide slurry with moderate viscosity (30-150 thousand mPa.s). The graphene heat dissipation film is prepared by adopting a coating method, the graphene oxide film with the thickness of 15-2500 microns can be prepared after the prepared graphene oxide slurry is smeared and dried, and the graphene heat dissipation film with the thickness of 10-500 microns, the density of 1.6-2.2 g/cm<3> and the heat conductivity coefficient of more than 1,000 W/m.K can be prepared after sintering and calendering.

Description

technical field [0001] The invention relates to a graphene heat dissipation film, in particular to a heat conduction graphene heat dissipation film with adjustable thickness and a preparation method thereof. Background technique [0002] As portable smart devices such as smartphones and tablet computers are more and more widely used in daily life, in order to improve the performance of the devices, the CPU, GPU and other chips used in these devices are becoming more and more refined, and the number of transistors per unit As a result, the heat generation per unit area also increases, but the heat dissipation area of ​​the device remains unchanged, so higher requirements are placed on heat dissipation. [0003] In the 4G era. In smart devices such as mobile phones, the mainstream interface thermal conductivity material is PI graphitized artificial graphite heat dissipation film, which has ultra-high thermal conductivity and excellent physical and chemical properties and has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14C01B32/184
CPCC09K5/14C01B32/184
Inventor 徐小希何大平
Owner 安徽今海汉烯科技有限公司
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