Adhesive layer slurry preparation material, preparation method and gas sensor
A bonding layer, slurry technology, applied in the analysis of materials, material analysis by electromagnetic means, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of poor bonding strength, ceramic core cracking, gas The problem of poor tightness, etc., can improve the air tightness, reduce the sintering temperature, and match the shrinkage rate.
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[0053] The embodiment of the present invention also provides a method for preparing adhesive layer slurry using the adhesive layer slurry preparation material, comprising the following steps:
[0054] ball milling the zirconia powder, the yttrium oxide powder, the inorganic additive, the organic solvent, and the organic additive for 12 to 36 hours to obtain a mixture;
[0055] Adding the organic vehicle and the organic additive to the mixture, and continuing ball milling for 12 to 36 hours to obtain a pre-slurry;
[0056] Filter the pre-slurry through a 100-400-mesh filter, adjust the viscosity and let it stand for at least 1 hour to obtain the adhesive layer slurry.
Embodiment 1
[0063] In this embodiment, the preparation material of the adhesive layer slurry contains the following components in mass percent:
[0064] Zirconia powder: 56.51%, D50: 0.5987μm;
[0065] Yttrium oxide powder: 2.77%, D50: 0.1624μm;
[0066] Inorganic additives: 1.52% Al 2 o 3 ~SiO2 2 , where the mass ratio of Al 2 o 3 : SiO 2 :=2:1;
[0067] Organic solvent: 32.39% mixture of terpineol, butyl glycol ether and dimethylacetamide, wherein the mass ratio of terpineol: butyl glycol ether: dimethylacetamide = 3:1:2;
[0068] Organic vehicle: 3.62% ethyl cellulose;
[0069] Organic additives: 0.64% dispersant (silane coupling agent), 1.55% plasticizer (a mixture of dibutyl phthalate and triethylene glycol diisocaprylate), 0.5% defoamer ( foam breaking polymer and polysiloxane solution), 0.5% thixotropic agent (modified urea solution).
[0070] The method steps for preparing the adhesive layer slurry and the adhesive layer by using the above materials are as follows:
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Embodiment 2
[0076] In this embodiment, the preparation material of the adhesive layer slurry contains the following components in mass percent:
[0077] Zirconia powder: 53.37%, D50: 0.6491μm;
[0078] Yttrium oxide powder: 4.1%, D50: 0.1624μm;
[0079] Inorganic additives: 2.72% Al 2 o 3 ~SiO2 2 ~MgO~CaO, the mass ratio of Al 2 o 3 : SiO 2 :MgO:CaO=29:21:2:1;
[0080] Organic solvent: 29.57% mixture of terpineol, isobutanol and propyl acetate, wherein the mass ratio of terpineol:isobutanol:propyl acetate=5:1:1;
[0081] Organic carrier: 5.37% mixture of polyvinyl butyral and ethyl cellulose, wherein the mass ratio of polyvinyl butyral: ethyl cellulose = 1:1;
[0082] Organic additives: 0.92% dispersant (polyester copolymer), 2.15% plasticizer (a mixture of dibutyl phthalate and triethylene glycol diisocaprylate), 0.6% thixotropic agent ( modified urea solution), 0.8% leveling agent (polyether modified methyl alkyl polysiloxane copolymer), 0.4% lubricant (polyethylene glycol).
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