Method, apparatus and system for determining optimum operation recipe for optical film-thickness measuring device
A measuring device, optical technology, applied in the direction of measuring device, grinding device, work carrier, etc., can solve the problems of time-consuming, time-consuming, dependence, etc.
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[0080] Hereinafter, embodiments of the present invention will be described with reference to the drawings. figure 1 It is a schematic diagram which shows one embodiment of a grinding|polishing apparatus. Such as figure 1 As shown, the polishing device has: a polishing table 3 supporting the polishing pad 2; a wafer W as an example of a substrate is pressed on the polishing head 1 of the polishing pad 2; a table motor 6 is made to rotate the polishing table 3; A slurry supply nozzle 5 for supplying slurry. The upper surface of the polishing pad 2 constitutes a polishing surface 2 a for polishing the wafer W. As shown in FIG.
[0081] The grinding head 1 is connected to the head shaft 10, and the grinding head 1 and the head shaft 10 rotate together in the direction indicated by the arrow. The polishing table 3 is connected to a table motor 6, and the table motor 6 is configured to rotate the polishing table 3 and the polishing pad 2 in the direction indicated by the arrow. ...
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