Polymer flexible conductive film and preparation method thereof

A flexible conductive and polymer technology, used in magnetic films, equipment for manufacturing conductive/semiconducting layers, and cable/conductor manufacturing, etc. and other problems, to achieve the effect of low material cost and simple manufacturing process

Active Publication Date: 2021-01-05
深圳市法鑫忠信新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the defects of poor flexibility, impurity signal shielding effect and heat resistance performance of the flexible conductive film in the prior art, and propose a polymer flexible conductive film and its preparation method

Method used

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  • Polymer flexible conductive film and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A polymer flexible conductive film, comprising a generation layer and a molding layer,

[0029] The resulting layer mainly includes the following components according to the mass fraction ratio: 3 parts of 3,4-ethylenedioxythiophene; 5 parts of polystyrenesulfonic acid; 5 parts of ferric oxide; 2 parts of tin oxide; 1 part of indium oxide; Magnesium 3 parts;

[0030] The molding layer mainly includes the following components: 8 parts of organic salt solution; 3 parts of reinforcing agent.

[0031] The organic salt solution is specifically 4-pyridine acetate hydrochloride,

[0032] The reinforcing agent is specifically a graphite molecular solution.

[0033] A method for preparing a polymer flexible conductive film, comprising the steps of:

[0034] S1: Clean and dry the surface of the substrate;

[0035] S2: After uniformly mixing 3,4-ethylenedioxythiophene, polystyrene sulfonic acid and ferric oxide particles, prepare a basic film on the surface of the collection b...

Embodiment 2

[0045] A polymer flexible conductive film, comprising a generation layer and a molding layer,

[0046] The resulting layer mainly includes the following components according to the mass fraction ratio: 8.5 parts of 3,4-ethylenedioxythiophene; 7 parts of polystyrenesulfonic acid; 9 parts of ferric oxide; 5 parts of tin oxide; 3 parts of indium oxide; Magnesium 4 parts;

[0047] The molding layer mainly includes the following components: 10 parts of organic salt solution; 5.5 parts of reinforcing agent.

[0048] The organic salt solution is specifically 4-pyridine acetate hydrochloride.

[0049] The reinforcing agent is specifically a graphite molecular solution.

[0050] A method for preparing a polymer flexible conductive film, comprising the steps of:

[0051] S1: Clean and dry the surface of the substrate;

[0052] S2: After uniformly mixing 3,4-ethylenedioxythiophene, polystyrene sulfonic acid and ferric oxide particles, prepare a basic film on the surface of the collec...

Embodiment 3

[0062] A polymer flexible conductive film, comprising a generation layer and a molding layer,

[0063] The resulting layer mainly includes the following components according to the mass fraction ratio: 10 parts of 3,4-ethylenedioxythiophene; 9 parts of polystyrenesulfonic acid; 12 parts of ferric oxide; 8 parts of tin oxide; 5 parts of indium oxide; Magnesium 6 parts;

[0064] The molding layer mainly includes the following components: 12 parts of organic salt solution; 8 parts of reinforcing agent.

[0065] The organic salt solution is specifically 4-pyridine acetate hydrochloride.

[0066] The reinforcing agent is specifically a graphite molecular solution.

[0067] A method for preparing a polymer flexible conductive film, comprising the steps of:

[0068] S1: Clean and dry the surface of the substrate;

[0069] S2: After uniformly mixing 3,4-ethylenedioxythiophene, polystyrene sulfonic acid and ferric oxide particles, prepare a basic film on the surface of the collecti...

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Abstract

The invention discloses a polymer flexible conductive film and a preparation method thereof, and belongs to the technical field of polymer material preparation. The polymer flexible conductive film comprises a generation layer and a forming layer, and the generation layer mainly comprises the following components: 3, 4-ethylenedioxythiophene; polystyrene sulfonic acid; ferroferric oxide; tin oxide; indium oxide; magnesium hydroxide; the forming layer mainly comprises the following components: an organic salt solution; and a reinforcing agent; according to the invention, the tensile property and the shielding effectiveness of the produced film are effectively improved by utilizing the sputtering spraying reaction of magnesium hydroxide and graphite, and the problem of low overall conductivity caused by magnesium hydroxide is neutralized by tin oxide and indium oxide; and the organic salt solution of 4-pyridine acetate hydrochloric acid can effectively enhance the flexibility and heat resistance of the polymer flexibility.

Description

technical field [0001] The invention relates to the technical field of polymer material preparation, in particular to a polymer flexible conductive film and a preparation method thereof. Background technique [0002] In mobile terminal products, flexible printed circuit boards are widely used in the electrical connection between modules and printed circuit boards, such as camera modules with flexible printed circuit boards, liquid crystal display modules, etc. Flexible printed circuit boards have the characteristics of thin thickness, light weight, and bendability, and are widely used in electronic products. [0003] The manufacturing process of flexible printed circuit board products currently on the market is complicated. Affected by the properties of polymer matrix materials, chemical etching is often used, and then the metal plate material layer is laminated to form a multi-layer composite material. This structure is very suitable for flexible printing. When circuit boa...

Claims

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Application Information

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IPC IPC(8): H01B5/14H01B1/08H01B1/12H01B13/00H01F10/00H01F41/00H05K9/00
CPCH01B5/14H01B1/08H01B1/12H01B13/0026H01F10/005H01F41/00H05K9/0081
Inventor 梁燕
Owner 深圳市法鑫忠信新材料有限公司
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