LED support processing method

A technology of LED bracket and processing method, which is applied to electrical components, electric solid devices, circuits, etc., can solve the problems of occupying bracket pads, not including voltage stabilization and anti-pulse functions, affecting the arrangement of light-emitting chips, etc., and achieves broad application prospects. Excellent voltage stabilization and anti-pulse ability, simple operation effect

Pending Publication Date: 2020-12-29
深圳市中顺半导体照明有限公司
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Problems solved by technology

[0002] At present, the conventional LED bracket does not include the voltage stabilizing and anti-pulse function. If this function needs to be added, the common method is to add a solid Zener diode process in the LED packaging process, which requires the space of the bracket pad, which will not only affect the The arrangement of the light-emitting chips, and the Zener diode will absorb part of the light, which will affect the light-emitting efficiency of the lamp bead

Method used

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Embodiment Construction

[0015] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0016] refer to Figure 1-4 , the specific implementation method adopts the following technical scheme: a LED bracket processing method, the steps are: stamping and forming the bracket crystal bonding pad in the form of a metal strip, after finishing the coating, entering the crystal bonding machine in the form of a strip, passing Solid crystal machine and flux fix the transient diode TVS on the pad of the bracket, perform eutectic welding by reflow soldering, and then perform injection molding process, inject molding on the metal strip, and include the transient diode TVS in the plastic frame , made into an LED bracket.

[0017] It is worth noting that the metal strip is formed by punching a copper material strip, and a position matching the dem...

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Abstract

The invention discloses an LED support processing method, and relates to the technical field of LEDs. The method comprises the following steps: stamping and forming a support die bonding pad in the form of a metal material strip, after a coating is formed, enabling the support die bonding pad to enter a die bonder in the form of a material strip, fixing a transient voltage suppressor (TVS) on thesupport die bonding pad through the die bonder and soldering flux, performing eutectic welding through reflow soldering, then performing an injection molding process, and performing injection moldingon the metal material strip, so as to enable the transient voltage suppressor (TVS) to be contained in a plastic frame body to manufacture the LED support. The LED support manufactured by the invention does not influence the arrangement of light-emitting chips and the light-emitting efficiency of lamp beads, and an LED device produced based on the LED support has excellent voltage-stabilizing andpulse-resisting capabilities and a wide application prospect.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a method for processing an LED bracket. Background technique [0002] At present, the conventional LED bracket does not include the voltage stabilizing and anti-pulse function. If this function needs to be added, the common method is to add a solid Zener diode process in the LED packaging process, which requires the space of the bracket pad, which will not only affect the The arrangement of the light-emitting chips, and the Zener diode will absorb part of the light, which will affect the light-emitting efficiency of the lamp bead. In order to solve the above problems, it is particularly necessary to design a new processing method for LED brackets. Contents of the invention [0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a method for processing LED brackets, which will not affect the arrangement of light-emitting chips and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/62H01L21/60
CPCH01L24/81H01L33/483H01L33/52H01L33/62H01L2224/81
Inventor 黄山虎杨锦德黄杰覃焕松
Owner 深圳市中顺半导体照明有限公司
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