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Thermopile sensor and manufacturing method thereof and electronic device

A technology of a thermopile sensor and a manufacturing method, which is applied in the manufacture/processing of thermoelectric devices, thermoelectric devices, heat exchange equipment, etc., can solve the problem that the accuracy of the device needs to be improved, and achieves avoiding the loss of inductive information, shortening the interconnection length, and improving the accuracy of the device. The effect of favoring miniaturization

Active Publication Date: 2020-12-22
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]However, the device accuracy of existing thermopile sensors needs to be improved

Method used

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  • Thermopile sensor and manufacturing method thereof and electronic device
  • Thermopile sensor and manufacturing method thereof and electronic device
  • Thermopile sensor and manufacturing method thereof and electronic device

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Experimental program
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Embodiment Construction

[0022] It can be known from the background art that the device precision of the existing thermopile sensor needs to be improved.

[0023] After analysis, the traditional thermopile sensor, by depositing polysilicon / metal on the dielectric film to make thermocouple pairs to sense temperature information, and then forms a heat-insulating cavity under the dielectric film by anisotropic wet etching of silicon on the back side. The thermal resistance is increased, and the thermocouple pair is electrically connected to the circuit structure formed on the sides of the thermocouple pair, so as to realize the transmission of the induction signal. However, there is no substrate structure under the device formed by this method, and the heat in the heat-insulating cavity will still be lost in a certain form, so that the measurement accuracy of the thermopile sensor is not high.

[0024] In order to solve the technical problem, an embodiment of the present invention provides a thermopile s...

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Abstract

The invention provides a thermopile sensor and a manufacturing method thereof, and an electronic device, the thermopile sensor comprises in order in the incident radiation direction: a thermopile structure plate, wherein the thermopile structure plate is provided with a heat radiation induction area, and a thermopile structure is formed in the heat radiation induction area; a support layer; and acircuit substrate, wherein a first cavity is defined by the circuit substrate, the thermopile structure plate and the support layer, the thermopile structure is arranged above the first cavity, a heatradiation reflection plate and a heat radiation isolation plate are arranged at the bottom of the first cavity, the heat radiation reflection plate is located above the heat radiation isolation plate, and the heat radiation isolation plate is located above the thermopile structure plate. Therefore, the measurement precision of the thermopile sensor can be improved.

Description

technical field [0001] The invention relates to the technical field of sensor manufacturing, in particular to a thermopile sensor, a manufacturing method thereof, and electronic equipment. Background technique [0002] A thermopile (thermal-pile) is an element that can convert temperature difference and electric energy into each other. It consists of two or more thermocouples connected in series. The thermoelectric potentials output by each thermocouple are superimposed on each other. When there is a temperature difference, an electric current is generated. [0003] Thermopile sensors can be equipped with various lenses and filters, so as to realize temperature measurement (forehead thermometer, ear thermometer, food temperature detection, etc.), qualitative / quantitative analysis of gas components, smart home appliances, lamp switches, medical equipment, etc. applications in various application scenarios. [0004] However, the device accuracy of existing thermopile sensors...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/32H01L35/08H01L35/10H01L35/34F16L59/02G01J5/00G01J5/12G01J5/14G01K7/00H10N10/17H10N10/01H10N10/817H10N10/82
CPCF16L59/021G01J5/12G01J5/00G01J5/14G01K7/003G01J2005/123G01J2005/0077H10N10/82H10N10/817H10N19/101H10N10/01H10N10/17
Inventor 黄河
Owner NINGBO SEMICON INT CORP
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