Microwave component circuit coupling transmission performance prediction method based on gold belt bonding configuration

Abstract

The invention discloses a microwave component circuit coupling transmission performance prediction method based on a gold belt bonding configuration. The method comprises the following steps: determining gold belt bonding interconnection geometry, physical properties and interconnection electromagnetic transmission parameters; establishing a configuration parameterization representation model; establishing an interconnection area piecewise discrete and linear equivalent circuit; solving a gold belt bonding interconnection integral transfer matrix, scattering parameters and absorption loss; andestablishing a gold belt bonding interconnection configuration and signal transmission performance circuit coupling model. According to the method, gold belt bonding interconnection configuration parametric representation modeling can be realized, and gold belt bonding interconnection configuration and signal transmission performance path coupling model construction is realized. By utilizing thecoupling model, accurate prediction from the morphological parameters of the microwave interconnection structure to the signal transmission performance can be realized, the design and optimization ofa high-performance microwave assembly are guided, the development quality of microwave products is effectively improved, the cost is saved, and the development period is shortened.

Description

technical field [0001] The invention belongs to the technical field of microwave radio frequency circuits, in particular to a method for predicting the circuit coupling transmission performance of microwave components based on gold ribbon bonding configuration, which can be used to guide circuit interconnection design optimization and electromagnetic transmission performance regulation in microwave components. Background technique [0002] Driven by the rapid development of electronic information technology in the new century, microwave circuits and components are widely used in communications, navigation, countermeasures, identification and other aerospace fields. The urgent demand for the continuous and rapid improvement of the performance of electronic equipment has made the development of microwave components, which are the core units and components of electronic equipment, increasingly in the direction of miniaturization, multi-function, high speed and high reliability. ...

AI Technical Summary

Problems solved by technology

For the typical interconnection between circuit modules in microwave components, the traditional direct soldering rigid connection is replaced by the gold ribbon bonded interconnection structure with arched and curved shape, which can buffer the interconnection itself and the external load it bears. This flexible structure The reliability of the interconnection is greatly improved, but due to the initial irregular configuration of the gold ribbon bonding interconnection, and this configuration is more susceptible to deformation due to environmental loads, these change the discontinuity of the signal transmission path, which will affect the high The transmission performance of high-frequency microwave signals is significantly affected, and the change of the interconnection shape parameters has great uncertainty, which in turn causes the uncertainty of signal transmission after the interconnection

In the existing literature, there are few reports on the impact mechanism of interconnection form and signal transmission performance. However, engineering mostly stays on manual experience and a large number of software simulations, which cannot accurately and effectively realize signal transmission performance prediction and regulation, resulting in high labor costs. , and the work efficiency is low

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