Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of printed circuit board

A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuit manufacturing, printed circuit, printed circuit drying, etc., can solve the problems of reducing printed circuit board production costs, shortening the production cycle of printed circuit boards, etc., so as to reduce material costs and save the effect of time

Inactive Publication Date: 2020-12-04
JIANDING HUBEI ELECTRONICS CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] Aiming at the defects existing in the prior art, the technical problem solved by the present invention is: how to greatly shorten the production cycle of the printed circuit board and significantly reduce the production cost of the printed circuit board on the basis of ensuring the quality of the printed circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of printed circuit board
  • Manufacturing method of printed circuit board
  • Manufacturing method of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] Conjunction with the drawings and embodiments of the present invention is described in further detail.

[0041] See image 3 As shown in the embodiment of manufacturing method of a printed circuit board embodiment of the present invention, comprising the steps of:

[0042] S1: cleaning the surface; and a printed circuit board through the metal plating layer (e.g., copper) surface oxide film, the removal of grease and other debris, and the roughened metal layer; performed prior to this step, the printed circuit board may according to need treatment or ultra-roughening treatment by sand blasting (Pumice).

[0043] S2: resist ink spray; cleaning the surface of the completed printed circuit board carried into the resist ink coating spraying equipment to form a solder resist layer; the thickness of the solder resist layer according to the forward speed of the printed circuit board, and spray equipment the amount of ink spray decision.

[0044] Preparation of the solder resist ink...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a manufacturing method of a printed circuit board, and relates to the field of circuit board manufacturing. The method comprises the following steps: removing impurities on thesurface of a metal layer of the printed circuit board; performing solder mask ink spraying on the printed circuit board to form a solder mask layer; and sequentially carrying out primary baking, exposure and development, secondary baking and gold plating on the printed circuit board. On the basis of ensuring the quality of the printed circuit board, the manufacturing period of the printed circuitboard is greatly shortened, and the manufacturing cost of the printed circuit board is remarkably reduced.

Description

Technical field [0001] The present invention relates to the field of circuit board production, particularly relates to a method for manufacturing a printed wiring board. Background technique [0002] Printed circuit board surface is usually disposed one solder resist layer, its function is to cover the surface of the printed circuit board conductors do not need welding. There is now widely used screen printing to form the solder resist layer. [0003] See figure 1 , The conventional method for manufacturing a printed circuit board is generally: [0004] S101: fourth time cleaning the surface; the surface of the printed circuit board cleaning process is performed for the first time; the printed circuit board through the metal plating layer (e.g., copper) surface oxide film, the removal of grease and other debris, and metal roughened layer; [0005] S102: screen printing; mesh plate placed on the surface of the printed circuit board, by screen printing, to the surface of the printe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/22H05K3/26
CPCH05K3/00H05K3/26H05K3/227H05K3/0082H05K2203/0548
Inventor 费云祥李鸿吴泽平黄鹏飞
Owner JIANDING HUBEI ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products