Copper-molybdenum lamination etchant for tft-lcd process
A technology of etching solution and copper-molybdenum, which is applied in the field of copper-molybdenum composite etching solution for TFT-LCD manufacturing process, can solve the problems of low service life of etching solution, unstable etching process, large fluctuation of pH value of etching solution, etc., and achieve long life, Etching process stabilization effect
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Embodiment 1
[0067] Embodiment 1 etching solution is respectively 1000ppm, 3000ppm, 5000ppm, 7000ppm when copper ion content is etched TFT substrate scanning electron microscope sectional view as Figure 1~4 . The top view of the scanning electron microscope of the TFT substrate etched by the etching solution of embodiment 1 when the copper ion content is 7000ppm is as Figure 5 .
[0068] The etchant etching situation of comparative example is as follows:
[0069] In the etching solution of Comparative Example 1 that does not contain a chelating agent, the etching angle of the etched TFT substrate is greater than 60°, and there is obvious molybdenum residue, and when the concentration of copper ions in the etching solution reaches 5000, the etching solution has already failed, and normal etching cannot be performed. .
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