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LED chip packaging structure

A technology of LED chip and packaging structure, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of uneven light output, yellow edge, weak light efficiency, etc., and achieve the effect of improving light output efficiency

Active Publication Date: 2020-11-20
安晟技术(广东)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The packaged LED chip has single-side (top) light-emitting and multi-side light-emitting types. For multi-side light-emitting LED chips, it is necessary to coat the four sides and the top surface with fluorescent glue, but coat five light-emitting surfaces at the same time. During the flat curing process, it is easy for the phosphor to settle to the bottom of the four sides, resulting in uneven light output, weak light effect, and yellow edges at the bottom, which seriously affect product quality

Method used

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Embodiment Construction

[0026] The scheme of this application is further described in conjunction with the accompanying drawings as follows:

[0027] Such as figure 1 As shown, a LED chip packaging structure includes an LED chip 2, a first fluorescent adhesive layer 4 is provided on the peripheral side of the LED chip 2, and a second fluorescent adhesive layer 5 is provided on the top surface of the LED chip 2. A protective film layer 6 is disposed on the second fluorescent glue layer 5 .

[0028] The first fluorescent glue layer 4 includes the following components by weight:

[0029] Silica gel: 85-115 parts by weight;

[0030] Phosphor powder: 76-83 parts by weight;

[0031] Anti-sedimentation powder: 0.3 to 0.8 parts by weight;

[0032] Diffusion powder: 1 to 3 parts by weight.

[0033] The anti-sedimentation powder includes nano-aluminum silicate, superfine calcium silicate and fumed silica, and the mass ratio of the nano-aluminum silicate, superfine calcium silicate and fumed silica is (1-1...

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Abstract

The invention provides an LED chip packaging structure which comprises an LED chip, a first fluorescent glue layer is arranged on the peripheral side of the LED chip, a second fluorescent glue layer is arranged on the top surface of the LED chip, and a protective film layer is arranged on the second fluorescent glue layer. The first fluorescent glue layer comprises the following components in parts by weight: 85-115 parts of silica gel; 76-83 parts by weight of fluorescent powder; 0.3-0.8 part by weight of anti-settling powder; and 1-3 parts by weight of diffusion powder. The LED chip packaging structure provided by the invention can improve the situation that fluorescent powder settles on the fluorescent glue layer of the LED chip.

Description

technical field [0001] The invention relates to a packaging structure of an LED chip. Background technique [0002] In the manufacturing process of LED lights, LED chips need to be packaged. The packaged LED chip has single-side (top) light-emitting and multi-side light-emitting types. For multi-side light-emitting LED chips, it is necessary to coat the four sides and the top surface with fluorescent glue, but coat five light-emitting surfaces at the same time. In the flat curing process, it is easy for the phosphor to settle to the bottom of the four sides, resulting in uneven light emission, weak light effect, and yellow edges at the bottom, which seriously affect the product quality. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the present invention proposes a packaging structure for LED chips, which can improve the situation of fluorescent powder sedimentation in the fluorescent glue layer of LED chips. [0004] The prese...

Claims

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Application Information

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IPC IPC(8): H01L33/56H01L33/50H01L33/54
CPCH01L33/56H01L33/505H01L33/54
Inventor 麦家通戴轲
Owner 安晟技术(广东)有限公司
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