Modular structure for LNG receiving station

Abstract

The invention provides a modular structure for an LNG receiving station. The modular structure is provided with a ship loading and unloading module, a storage tank module, a high-pressure conveying module, a recondenser module, a BOG processing module, an SCV module, an ORV module, a torch module, a tank wagon loading and unloading module and a main pipe rack module. The whole device can be formedby constructing the plurality of modules and a plurality of skids like constructing Lego building blocks, and all the modules are independently skids, so that construction and installation are convenient, and meanwhile the internal modules can be independently detached or replaced during maintenance; and according to the modular structure for the LNG receiving station, the on-site construction, installation and debugging time is greatly shortened, the construction and debugging personnel are reduced, the on-site machine tool cost is saved, the large-scale, comprehensive, integrated and intelligent development trend and direction of the LNG receiving station can be adapted, the integration level of the device is improved, the equipment investment is reduced, and the occupied area of a factory is saved.

Description

Technical field [0001] The invention relates to an LNG receiving station, in particular to a modularized LNG receiving station. Background technique [0002] A typical LNG receiving station includes: unloading system, storage system, boil-off gas processing system, pressurizing system, gasification export system and tank truck loading system. In the traditional LNG receiving station project, the unloading system, storage system, vaporized gas treatment system, pressurization system, gasification export system and tank truck loading system are all supplied in bulk, and they are delivered to the site. installation. [0003] These systems are relatively complex, and the EPC general contractor supplies spare parts on site. There are millions of construction materials such as equipment, cables, meters, bridges, steel structures, etc., and the construction of thermal insulation coating on site is very difficult. Restricted by weather factors, the construction and commissioning cycle is...

AI Technical Summary

Problems solved by technology

[0003] These systems are relatively complex, and the EPC general contractor supplies them in bulk on site. There are millions of pieces of construction materials such as equipment, cables, instruments, bridges, and steel structures. It is very difficult to apply thermal insulation coating on site. And due to weather factors, the construction and commissioning period is long, the overall progress of the project is slow, the manufacturer's coordination is difficult, and the on-site service fee is high

The traditional technical solution leads to a large area of ​​the device, a long execution period, high investment costs, and a huge increase in construction risks. It is difficult to adapt to the development trend and direction of large-scale, integrated, and intelligent devices. Specifically, it has the following shortcomings or deficiencies :

[0004] 1. The huge amount of construction and the long installation period seriously affect the progress of the on-site project;

[0005] 2. The construction work is affected and restricted by the site environment;

[0006] 3. There are many spare parts, and it is easy to miss or lose parts on site;

[0007] 4. It is difficult for manufacturers to coordinate and the cost of service labor is high;

[0008] 5. The installation is complicated, and the requirements for installation instructors and on-site construction personnel are relatively high;

[0009] 6. Higher requirements for construction accuracy of civil foundations;

[0010] 7. There are many coordination interfaces for EPC general contractors, and the management is very complicated;

[0012] 9. Huge investment in equipment and poor economic benefits;

[0013] 10. Waste of factory land, resulting in tense layout;

[0014] 11. It cannot adapt to the development direction of large-scale and integrated devices, and the degree of device integration is poor

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