heat sink

Abstract

The present invention provides a radiator that includes a light-weight heat transfer member that has excellent pressure resistance to atmospheric pressure without impairing the flowability of a working fluid in the gaseous phase, and that can make the heat receiving portion of the heat transfer member Homogenization of heat input in. The heat sink includes: a heat transfer component having a heat receiving portion thermally connected to the heat generating body; The heat receiving part communicates with the heat dissipation part and is enclosed with an integral internal space of working fluid. In the internal space of the heat receiving part, an inner surface area increasing part of the heat receiving part and a support member are arranged, and the support member has an inner surface area of ​​the heat receiving part. Increase face-to-face contact.

Description

technical field [0001] The present invention relates to a heat sink for cooling electric / electronic components and the like, and more particularly to a heat sink provided with a light-weight heat transfer member having excellent pressure resistance. Background technique [0002] With the increase in performance of electronic equipment, heat generating elements such as electronic components are mounted on a substrate at a high density inside the electronic equipment. A heat sink may be used as means for cooling a heat generating body such as an electronic component. As the heat sink, generally, a heat sink (heat pipe type heat sink) including a plurality of tubular heat pipes functioning as heat transfer members is used. [0003] As a heat pipe type heat sink, for example, there is a heat pipe type heat sink in which a plurality of flat fins protrude from an outer peripheral surface provided with a plurality of tubular heat pipes (Patent Document 1). The heat sink disclosed...

AI Technical Summary

Problems solved by technology

However, if a solid columnar member or a block member is accommodated in the entire internal space of the container, although pressure resistance can be obtained, the weight of the solid columnar member or block member increases, so there is still thermal connection with the container. Stress from columnar parts or bulk parts is applied to electronic parts, etc.

In addition, columnar members and block members may hinder the circulation of the gaseous working fluid enclosed in the inner space of the container.

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