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Adhesive sheet for temporary attachment and semiconductor device producing method using same

A technology for adhesives and semiconductors, applied in the direction of semiconductor devices, semiconductor/solid device manufacturing, grafted polymer adhesives, etc., can solve the problems of reduced adhesive strength, thermal decomposition, etc., to achieve reduced adhesive strength, excellent Adhesive strength, effects of excellent photoinitiation efficiency

Active Publication Date: 2020-09-11
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of conventional adhesives, there is a problem that additives in the adhesive such as a photoinitiator are thermally decomposed during a high temperature process, or that the adhesive strength decreases insufficiently in the peeling stage due to a migration phenomenon of the additive.

Method used

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  • Adhesive sheet for temporary attachment and semiconductor device producing method using same
  • Adhesive sheet for temporary attachment and semiconductor device producing method using same
  • Adhesive sheet for temporary attachment and semiconductor device producing method using same

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0107] A monomer mixture consisting of 75 g of 2-ethylhexyl acrylate (2-EHA), 5 g of 4-benzoylphenyl methacrylate, and 20 g of hydroxyethyl acrylate (HEA) was placed in a reactor equipped with a cooling system to allow nitrogen reflux and easy temperature control. Subsequently, based on 100 g of the monomer mixture, 400 μm of n-DDM (n-dodecylmercaptan) as a chain transfer agent (chaintransfer agent, CTA) and 100 g of ethyl acetate (EAc) as a solvent were added thereto, and after injection Nitrogen was thoroughly mixed with each other at 30° C. for 30 minutes or longer while removing oxygen in the reactor. Then, the temperature was raised and kept at 62° C., and 300 ppm of V-60 (azobisisobutyronitrile) was added thereto as a reaction initiator to initiate a reaction, followed by polymerization for 6 hours to prepare a primary reaction material.

[0108]24g of 2-methacryloyloxyethyl isocyanate (MOI) (90mol% based on HEA in the primary reaction material) and 0.24g of catalyst (D...

preparation example 2

[0111] A monomer mixture consisting of 20 g of ethyl acrylate, 63 g of 2-ethylhexyl acrylate (2-EHA), 2 g of 4-benzoylphenyl acrylate and 15 g of hydroxyethyl acrylate (HEA) was placed in a cooling system equipped In the reactor to achieve nitrogen reflux and easy temperature control. Subsequently, based on 100 g of the monomer mixture, 400 μm of n-DDM (n-dodecylmercaptan) as a chain transfer agent (CTA) and 100 g of ethyl acetate (EAc) as a solvent were added thereto, and nitrogen gas was injected to remove The oxygen in the reactor was thoroughly mixed with each other at 30°C for 30 minutes or longer. Then, the temperature was raised and kept at 62° C., and 300 ppm of V-60 (azobisisobutyronitrile) was added thereto as a reaction initiator to initiate a reaction, followed by polymerization for 6 hours to prepare a primary reaction material.

[0112] 15 g of 2-methacryloxyethyl isocyanate (MOI) (76 mol % based on HEA in the primary reaction material) and 0.15 g of catalyst (D...

preparation example 3

[0115] With 4g TDI-based isocyanate curing agent and 3g 2,2-dimethoxy-1,2-diphenylethan-1-one as photoinitiator and 100g preparation example 1 based on (meth)acrylate The binder resin (a-1) was mixed to prepare a composition (A-3) for forming an adhesive layer.

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Abstract

The present invention relates to an adhesive sheet for temporary attachment and a semiconductor device producing method using same, wherein the adhesive sheet has excellent heat-resistance, and thus can implement a sufficient adhesive force even when going through a high-temperature process among semiconductor producing processes and can exhibit sufficient reduction of an adhesive force through photocuring in a separation step.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims Korean Patent Application No. 10-2018-0042889 filed with the Korean Intellectual Property Office on April 12, 2018 and Korean Patent Application No. 10-2019-0034620 filed with the Korean Intellectual Property Office on March 26, 2019 The entire contents of which are hereby incorporated by reference. [0003] The present disclosure relates to an adhesive sheet for temporary attachment and a method of manufacturing a semiconductor device using the same. Background technique [0004] Recently, the trend toward miniaturization, thinning, and higher capacity of electronic devices is expanding, and demands for higher density and high integration of semiconductor packages are rapidly increasing. To reflect this, the size of semiconductor chips has gradually increased, while the thickness of the chips has become thinner. [0005] Thin semiconductor chips have problems that are diffic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/20C09J7/22C09J133/14C09J133/08H01L21/18
CPCC09J7/30C09J2301/416C09J2301/312C09J7/22C09J2203/326C08K5/0025H01L21/6836H01L2221/68327C09J133/066C09J133/062C08F220/1808C08F265/06C09J151/003C08F220/20C08F220/301C08F220/1802C08F220/36C09J7/20C09J133/14C09J133/08H01L21/185C09J2301/124C09J7/243C09J7/255C09J7/40C09J2301/208C09J2301/408C08K5/29C08K5/5397H01L2221/68386Y10T428/2848Y10T428/2891Y10T428/1476Y10T428/2809Y10T428/14
Inventor 金塞拉韩智浩张美李光珠
Owner LG CHEM LTD
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