LED chip pad printing device capable of customizing arrangement scheme

A technology of LED chips and pad printing devices, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, and circuits. Low, ingenious effect of the overall structure

Pending Publication Date: 2020-08-28
XIAMEN MINGDA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the small size and huge quantity of micro-LED chips, the existing automatic transfer devices use vacuum adsorption needles to directly absorb and transfer a single LED chip to the drive circuit board for direct bonding or first adsorption to the transfer tape, and the arrangement is single. Limited, users often cannot perform mass transfer according to the arrangement requirements of different LED chips on different driving circuits

Method used

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  • LED chip pad printing device capable of customizing arrangement scheme
  • LED chip pad printing device capable of customizing arrangement scheme
  • LED chip pad printing device capable of customizing arrangement scheme

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Please refer to Figure 1 to Figure 2 , an LED chip pad printing device 100 with a customizable arrangement scheme in the embodiment, including a pad printing platform 1 and an addressing adsorption control device 2; the pad printing platform 1 is provided with an initial fixed station and a target fixed station, The initial fixed station is provided with an LED chip carrier 11, and the target fixed station is provided with a target carrier 12; the addressing adsorption control device 2 includes an adsorption mechanism 21, a CCD optical positioning centering device and a wafer scanning block coordinate positioning system, the addressing adsorption control device 2 realizes transferring the LED chips on the LED chip carrier 11 to the on target vehicle 12.

[0040] The LED chip carrier 11 is customized, that is, the size and shape of the LED chip carrier 11 can be customized according to customer requirements, and can be 4 inches, 6 inches, 8 inches and other different s...

Embodiment 2

[0049] Please refer to image 3 , Figure 4 with Figure 5 The difference between embodiment 2 and embodiment 1 is that the adsorption mechanism 21 includes a magnet array template 221 and a conductive coil plate 222, and the conductive coil plate 222 is uniformly arranged with adsorption holes according to the chip unit pitch, and the adsorption Conductive coils are arranged in the holes, and the conductive coils in the adsorption holes are connected in series. The magnetic conductor array template 221 is arranged with several magnetic conductors 2121 according to the required array, and the conductive coil plate 222 can be lifted and arranged on the Above the LED chip carrier 11 and the adsorption holes correspond to the LED chips one by one, the magnetic conductor array template 221 can be lifted and arranged above the conductive coil plate 222 and the magnetic conductor 2121 and the adsorption holes corresponding settings.

[0050] Specifically, a threaded groove is pro...

Embodiment 3

[0054] Please refer to Image 6 The difference between embodiment 3 and embodiment 2 is that the adsorption mechanism 21 includes a magnet array template 221 and a conductive coil plate 222, and the conductive coil plate 222 is evenly arranged with a number of adsorption holes according to the chip unit pitch, so Conductive coils are provided on the outer wall of the conductive coil plate 222, and the magnetic conductor array template 221 is provided with a number of magnetic conductors 2121 arranged in an array as required. In addition, the suction holes correspond to the LED chips one by one, the magnetic conductor array template 221 can be lifted and lowered above the conductive coil plate 222 and the magnetic conductors 2121 are correspondingly provided to the suction holes.

[0055] Specifically, the outer side of the conductive coil plate 222 is provided with a threaded groove, and the threaded groove is used to fix and wind the conductive coil. One end of the conductive...

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PUM

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Abstract

The invention provides an LED chip pad printing device capable of customizing an arrangement scheme. The LED chip pad printing device comprises a pad printing platform and an addressing adsorption control device. An initial fixing station and a target fixing station are arranged on the pad printing platform, an LED chip carrier is arranged on the initial fixing station, and a target carrier is arranged on the target fixing station; the addressing adsorption control device comprises an adsorption mechanism, a CCD optical positioning centering device and a wafer scanning block coordinate positioning system. And the addressing adsorption control device is used for transferring the LED chips on the LED chip carrier to the target carrier according to the required arrangement array by controlling the adsorption mechanism to be magnetized according to the required arrangement array. The LED chip pad printing device capable of customizing the arrangement scheme is feasible in function, and thebeneficial effect of customizing the pad printing scheme according to the chip arrangement requirement of the target carrier can be achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a pad printing device for LED chips that can customize an arrangement scheme. Background technique [0002] Micro LED (Mini LED or Micro LED) is a drive circuit made of PCB, flexible FPC, BT and CMOS / TFT integrated circuit technology after the traditional LED structure is thinned, miniaturized and matrixed to realize the Dot addressable control and individually driven display technology. Due to the brightness, contrast, response time, viewing angle, resolution and other indicators of micro-LED technology are stronger than LCD and OLED technology, plus the advantages of self-illumination, simple structure, small size and energy saving, it has been widely accepted. focus on. [0003] After the micro-LED chips are fabricated, they need to be transferred to the driver circuit board to form an LED array, which is called Mass Transfer. Due to the small size and huge quantity ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683H01L33/00
CPCH01L21/67271H01L21/683H01L33/0095
Inventor 胡丹查选义陈鹏
Owner XIAMEN MINGDA TECH
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