Ceramic substrate porous array picosecond laser galvanometer scanning drilling system and method

Abstract

The invention provides a ceramic substrate porous array picosecond laser galvanometer scanning drilling system and method. The method comprises the steps that firstly a laser drilling route and a laser drilling technological parameter are arranged, during drilling, a station sliding table moves a hole to be drilled of a ceramic substrate to a drilling position, CCD vision identifies and positionsthe drilling position, and a galvanometer laser beam precisely drills the ceramic substrate layer by layer; meanwhile, smoke suction and protective gas are started, a cutting head automatically movesdown one layer of machining thickness for each layer machining until all the layers are machined; and then the station sliding table moves a workpiece to the next drilling position, repetition is carried out until all the holes in the ceramic substrate are drilled. According to the ceramic substrate porous array picosecond laser galvanometer scanning drilling system and method, cutting edges of the ceramic substrate are smooth, the roundness is good, the taper is small, the fragmentation probability is low, nearly no heat affected zone exists, the edges are not yellowed, nearly no damage is caused to the ceramic substrate, and the yield is greatly improved.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a porous array picosecond laser vibrating mirror scanning drilling system and method for a ceramic substrate. Background technique [0002] Ceramic materials such as alumina and aluminum nitride have the advantages of high thermal conductivity, high insulation and high temperature resistance, and are widely used in the fields of electronics and semiconductors. However, ceramic materials have high hardness and brittleness, and their forming and processing are very difficult, especially the processing of micropores. Due to the high power density and good directionality of the laser, lasers are commonly used to drill holes in ceramic substrates. At present, pulsed lasers or quasi-continuous lasers are generally used. The laser beam is focused on a laser beam placed perpendicular to the laser axis through an optical system. On the workpiece, a laser beam with high energy density (105...

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Problems solved by technology

[0003] Patent document CN110605488A discloses a ceramic laser drilling device. The invention uses a three-axis laser drilling system with xy+ cyclotron vibration for ceramic drilling of electronic and semiconductor devices, but it does not refer to what kind of laser is used. , and did not describe the drilling process in detail. In addition, cutting a circle with a larger diameter through a circular motion will result in low cutting efficiency due to the inertia of the machine itself.

[0004] Patent document CN105499812A discloses a method for improving the processing quality of ceramic heat dissipation substrates. The invention relates to a laser processing method for LED ceramic heat dissipation substrates. To solve the problems of oxidation and yellowing of the ceramic substrate during the drilling process, although the processing quality has been improved, the process has been significantly increased and the processing efficiency has been reduced. In addition, the laser used is also a conventional continuous solid-state laser.

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