Glass composition

Abstract

The invention provides a glass composition. The glass composition comprises the following components in percentage by mole: 55 to 80% of SiO2, 2 to 15% of B2O3, 0.5 to 10% of TiO2, 0.5 to 12% of ZnO,0 to 10% of Al2O3, 1 to 15% of Na2O and 1-12% of K2O. Through reasonable component design, the obtained glass composition has a proper thermal expansion coefficient, high ultraviolet light transmittance and excellent water resistance, acid resistance and alkali resistance, meets the requirements of large-caliber high-quality processing, and is suitable for the fields of semiconductor manufacturingand the like.

Description

technical field [0001] The invention relates to a glass composition, in particular to a glass composition which can be used in the field of semiconductor manufacturing. Background technique [0002] In the field of semiconductor manufacturing, materials such as metal, ceramics, and single crystal silicon are usually used as the substrate of the wafer during the manufacturing process to prevent the deformation of the wafer during lithography, cleaning, packaging and other processes. Although metal, ceramic, and single crystal silicon substrate materials have good mechanical strength and acid and alkali corrosion resistance, because the above substrate materials are opaque, a heating stripping process is required in the substrate and wafer stripping process. If a light-transmissive glass composition is used as the fabrication substrate, then a photolift-off process can be used. Compared with the thermal stripping process, the optical stripping process can greatly reduce the p...

AI Technical Summary

Problems solved by technology

[0004] During the chip manufacturing process, there will be many acid and alkali cleanings, which requires the glass substrate material to have excellent water resistance, acid resistance and alkali resistance, otherwise the glass substrate will dissolve into the process solution, causing great losses

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