Efficient multi-cutter cutting machine for workpiece rotation

Abstract

The invention discloses an efficient multi-cutter cutting machine for workpiece rotation. The efficient multi-cutter cutting machine comprises a base and a rack arranged above the base, wherein the base is provided with a crystal support assembly used for supporting workpieces; a cutting assembly used for cutting the workpieces is arranged above the rack and comprises cutting tool bits, a diamondwire drive mechanism and a walking drive assembly, wherein the cutting tool bits are used for achieving workpiece cutting through diamond wires, the diamond wire drive mechanism is used for driving the diamond wires in the cutting tool bits to move to achieve cutting action, and the walking drive assembly is used for moving the cutting tool bits; and a plurality of cutting tool bits are arranged and sequentially arranged in the length direction of the workpieces, and the distances between the cutting tool bits and the workpieces are different. According to the multi-cutter cutting machine produced through the scheme, the cutting process is smooth, the phenomena of edge breakage and the like are avoided, the whole operation process can be rapidly finished by one person, multi-person cooperative operation is not needed, the cut workpieces can be separated, the efficient multi-cutter cutting machine can be used for single-cutter cutting and can also achieve multi-cutter cutting, and applicability and expansibility are very high.

Description

technical field [0001] The invention belongs to the technical field of cutting devices, and in particular relates to a high-efficiency multi-knife cutting machine for workpiece rotation. Background technique [0002] Diamond wire cutting technology is a relatively advanced truncation processing technology in the world at present. Its principle is to cut the workpiece to be processed by high-speed moving diamond wire, so as to achieve the purpose of truncation. The diamond wire is guided by the guide wheel to form a wire net between the two wire rollers. When the silicon rod is fixed, the rise and fall of the wire net can realize the feeding of the silicon rod, coupled with the reciprocating motion of the diamond wire. Cutting force, so as to complete the truncation process of silicon rods, when multiple wire nets are set to operate at the same time, silicon rods can be cut into multiple pieces. [0003] The principle of multi-knife cutting silicon rods in the prior art is a...

AI Technical Summary

Problems solved by technology

This solution mainly has the following problems: the diamond wire and the silicon rod are always in line contact, and when cutting to the middle of the silicon rod, the cutting length is very large, resulting in low cutting efficiency, and at the same time, the large cutting force leads to poor cutting quality; when the diamond wire cuts to the bottom of the silicon rod When the gravity loading method reaches the critical fracture junction of the silicon rod, it is easy to break and cause the edge of the silicon rod to collapse; the contact length between the diamond wire and the silicon rod is large, and the cutting fluid is not easy to enter, resulting in poor cutting quality. Constant variation, resulting in less consistent cut quality

However, for rotating workpieces, the original multi-knife cutting machine head still has certain problems: when the silicon rod is rotated to a small remaining diameter, the strength of the remaining material cannot meet the drive to drive the rotation of the silicon rod, resulting in the silicon rod in the remaining material. Irregular fractures at places, resulting in poor cutting quality; point contact cutting technology requires that the silicon rods be placed on a tray that is always rotating during the cutting process, and the silicon rods must be kept stable during the rotation process. Silicon rods with different sizes and flatness can be adjusted adaptively, and the silicon rods can be separated after cutting, so that the cutting line can exit smoothly. At present, there is no crystal support device that can meet this requirement.

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