Method and device for reducing interference of ground to PCB high-speed signal line
A high-speed signal and interference device technology, which is applied to the reduction of circuit devices, crosstalk/noise/electromagnetic interference (, printed circuit components, etc., can solve the problems of high component density, transmission quality impact, server system performance reduction, etc. Achieve the effect of improving transmission quality, improving space utilization, and ensuring performance
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Embodiment 1
[0027] Reference attached figure 1 , this embodiment proposes a method for reducing ground interference to PCB high-speed signal lines. This method needs to add isolation bands on the PCB card. Five filter capacitors are arranged at intervals on the isolation bands. The isolation bands are used to separate other signals and The electromagnetic interference generated by the power supply GND is isolated from the reference GND of high-speed signals above 10G, and when connected to other reference GNDs, it passes through a filter capacitor to weaken the interference.
[0028] In this embodiment, the position of the isolation zone is between the high-speed signal above 10G and the power module with high radiation energy or the copper surface of the power supply with high current and the dense power ground via, which is used to connect the high-speed signal with other power supplies with high radiation energy Modules, high-current power supply copper planes or power supply planes th...
Embodiment 2
[0034] Reference attached figure 1 , On the basis of the first embodiment, a method for reducing the interference of the ground to the high-speed signal line of the PCB in this embodiment needs to add an isolation zone penetrating through all the GND layers on the PCB card.
[0035] Using the isolation zone, on the one hand, it can prevent the interference electromagnetic field from spreading outward and prevent the outside interference electromagnetic field from entering. At the same time, it can also isolate the interference electromagnetic waves from wires, components, etc., and use the filter capacitor at the output port to filter surface reflection and internal multiple Secondary reflection, which consumes most of the energy of interfering electromagnetic waves, has the function of weakening interference and protecting signals; on the other hand, it can greatly improve the space utilization of PCB boards, optimize other signals to better or add more Function, thus, the tr...
Embodiment 3
[0039] Reference attached figure 1 , this embodiment proposes a device for reducing ground interference to PCB high-speed signal lines. The structure of the device is an additional isolation zone on the PCB card and a filter capacitor arranged at intervals on the isolation zone. The isolation zone is used to separate other The electromagnetic interference generated by the signal and power supply GND is isolated from the high-speed signal reference GND above 10G, and is connected to other reference GNDs through a filter capacitor to weaken the interference.
[0040] In this embodiment, the position of the isolation zone is between the high-speed signal above 10G and the power module with high radiation energy or the copper surface of the power supply with high current and the dense power ground via, which is used to connect the high-speed signal with other power supplies with high radiation energy Modules, high-current power supply copper planes or power supply planes that coll...
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