Target holder applied to pulsed laser co-deposition and mounting method

Abstract

The invention provides a target holder applied to pulsed laser co-deposition and a mounting method of the target holder. The target holder comprises a target holder bottom and a target cover plate. Aprotruding peripheral wall is formed in the periphery of the target holder bottom, a round groove is formed in the middle of the target holder bottom, multiple screw holes are formed in the peripheralwall, and the target holder cooperates with a target. The target comprises a round target module and an annular target module, wherein the round target module and the annular target module can be independently dismounted and mounted. Through holes are formed in the side walls of the round target module and the annular target module, and through columns are arranged in the through holes. Two oppositely-arranged adjusting regions are further arranged on the target cover plate, and the two ends of the through columns are arranged in the adjusting regions. By means of the target holder, the position of the target can be arranged and fixed in the process of mounting the target, and the bombarded position of the target is effectively controlled. The utilization rate of the whole target is increased, pits generated by local losses of the target are avoided, and the scrapping speed of the target is reduced.

Description

technical field [0001] The invention relates to the field of manufacturing and processing semiconductors, in particular to a target holder applied to pulse laser co-deposition and an installation method. Background technique [0002] With the development of modern science and technology, thin film science has become one of the rapidly developing subject areas in recent years, and it is an important research field of condensed matter physics and material science. Functional thin film is the main aspect of thin film research. It not only has rich physical connotation, but also has a very wide range of applications in the fields of microelectronics, optoelectronics, and superconducting materials. [0003] For a long time, people have invented a variety of film-making technologies and methods: vacuum evaporation deposition, ion beam sputtering, magnetron sputtering deposition, molecular beam epitaxy, metal organic chemical vapor deposition, sol-gel method, etc. The above method...

AI Technical Summary

Problems solved by technology

When the target is self-propagating, if the focus is on the center of the circle, the center of the target will be highly consumed. If the focus is on a non-center position, the target will be highly consumed in a ring with the axis of the target holder as the center of the circle. In this way, the consumption of the target There will be obvious differences; in addition, the entire target must be replaced after the material on any part of the target deposition surface is consumed to the limit, which cannot realize the full utilization of the target material, which not only causes material waste, but also Increase the cost burden of the enterprise. Due to the low utilization rate of the target material, it is necessary to replace the target frequently, and frequent replacement of the target will shorten the maintenance cycle of the equipment, which will affect the capacity utilization of the equipment.

When the existing full-piece target is placed in the target holder, the center of the circular target cannot coincide with the center of the target holder, and the eccentric distance of the placement is random, which will cause the center of the bombardment ring to not coincide. It will lead to uneven bombardment position, resulting in uneven utilization of the entire target, serious local loss of the target, and pits, which accelerate the scrapping of the target

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