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Surface modification system before electroless plating and method for double modification of polymer substrate surface

A substrate surface, double modification technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problem of difficult direct chemical plating of polymer substrates, achieve excellent adhesion performance, simple process , the effect of scalability improvement

Active Publication Date: 2021-03-02
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to effectively solve the problem that polymer substrates are difficult to directly electroless plate, and has the advantages of wide application range, easy operation, low cost, environmental protection and high efficiency

Method used

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  • Surface modification system before electroless plating and method for double modification of polymer substrate surface
  • Surface modification system before electroless plating and method for double modification of polymer substrate surface
  • Surface modification system before electroless plating and method for double modification of polymer substrate surface

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Embodiment

[0037] (1) Surface roughening: Add potassium permanganate and concentrated sulfuric acid (98% concentrated sulfuric acid) into deionized water in sequence, and stir thoroughly to obtain a roughened solution, in which the concentration of potassium permanganate is 10 g / L. The concentration of sulfuric acid was 25 ml / L. After the roughening solution was heated to 45 °C, the polyphenylene ether (PPO) substrate was immersed in the solution for 15 min. Then prepare an oxalic acid solution with a concentration of 3 g / L, wash the roughened substrate with deionized water and place it in it, and treat it at room temperature until the surface of the substrate fades to its original state (generally about 5~10 min) .

[0038](2) Primary surface reconstruction modification: Dissolve Tris (Tris) reagent in deionized water and use hydrochloric acid to adjust the pH value of the solution to about 8.5 to obtain a buffer solution, and then add norepinephrine to the buffer solution Thoroughly s...

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Abstract

The invention relates to the field of surface modification technology and polymer metallization technology. It discloses a surface modification system before electroless plating and a method for double modifying the surface of a polymer substrate. The scheme is: first use roughening to pretreat the polymer substrate to improve the surface properties, and then use the oxidative self-polymerization reaction of catecholamine compounds to deposit the roughened substrate on the surface to form a polymer layer to realize the initial Surface reconstruction modification, through the Michael addition and Schiff base reaction between the polymer layer and specific amino acids, secondary surface reconstruction modification is carried out on the surface of the substrate to introduce active functional groups that can strongly adsorb metal ions, thereby achieving The tight bond between the deposited metal layer and the substrate after electroless plating.

Description

technical field [0001] The invention relates to the field of surface modification technology and polymer metallization technology, in particular to a surface modification system before electroless plating and a method for double modifying the surface of a polymer substrate. Background technique [0002] Polymer materials have low density, stable chemical properties, good insulation and excellent mechanical properties. After surface metallization, the surface of the substrate has metal properties such as electrical conductivity, magnetic conductivity, and thermal conductivity, which greatly broadens its potential. The scope of application is currently widely used in electronic communications, automobiles, medical office, aerospace and military and other fields. [0003] The surface roughness and low surface energy of the high molecular polymer substrate are small, and its surface metallization is difficult to realize, and the bonding strength between the formed metal layer an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/20C23C18/24C23C18/30C23C18/40
CPCC23C18/2073C23C18/24C23C18/30C23C18/40
Inventor 冯哲圣王康王焱赵永强
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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