Preparation method of injection molding structural part with integrated intelligent surface

Abstract

The invention relates to a preparation method of an injection molding structural part with an integrated intelligent surface. The preparation method comprises the following steps that A, a conductivecircuit is printed on the back side of a substrate by using conductive ink; B, insulating ink is printed on the conductive circuit in a covering mode, and the conductive circuit is thoroughly dried; C, the printed substrate is pressed into a printed product in a 3D shape; D, an electronic component is electrically connected to the corresponding position of the conductive circuit on the printed product which is pressed into the 3D shape by using a conductive adhesive; and E, the 3D-shaped printed product electrically connected with the electronic component is placed in an injection mold, a molten injection molding material is added for injection molding, and the injection molding structural part with the integrated intelligent surface is obtained. According to the preparation method of theinjection molding structural part with the integrated intelligent surface, the electronic components and circuits are directly embedded into the injection molding structural part, connection with an FPCB is not needed, surface intellectualization of the injection molding structural part is directly achieved, the weight is obviously reduced, the space is obviously reduced, and the injection moldingstructural part has great advantages in the aspects of moisture prevention and dust prevention.

Description

technical field [0001] The invention relates to the field of printing technology, in particular to a method for preparing an injection-molded structural part of an integrated smart surface. Background technique [0002] At present, new energy vehicles, airplanes, home appliances, consumer electronics and other industrial fields use the process of combining touch panels and flexible circuit boards, which is particularly bulky in structure, and the cost is high, and the production is complicated. Lightweight in the future The requirements side is not conducive to continuous development. [0003] In the patent CN201410749946, an out-of-mold electronic film and its production method are proposed. This process has relatively large defects in the fixing and position of electronic components. The grooves of plastic parts in electronic components are easy to cause loosening, and the operation is particularly troublesome. Patent CN201721683724 proposes an integrated intelligent surf...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing an injection-molded structural part of an integrated smart surface, which solves the problems of heavy structure, complicated manufacture, and high cost in the process of combining the touch panel where the electronic components are located and the flexible circuit board in the prior art. question