Etching equipment special for quartz wafer production and using method thereof

Abstract

The invention relates to the field of quartz wafer production equipment, in particular to etching equipment special for quartz wafer production and a using method thereof. The etching equipment comprises a stand frame, a driving mechanism and a conveying belt are arranged on the stand frame; a driving mechanism is located above conveying belt, connecting rod assemblies are arranged on the two sides of the driving mechanism, the connecting rod assembly on the right side is connected with an etching solution output mechanism, the connecting rod assembly on the left side is connected with a cleaning solution output mechanism, the cleaning solution output mechanism is connected with a waste liquid recycling mechanism, the conveying belt is connected with the driving mechanism through a chain wheel assembly, and multiple solution pools are fixed to the conveying belt at equal intervals. The invention discloses the etching equipment special for quartz wafer production and the using method thereof. The conveying belt is driven by the driving mechanism to convey quartz wafers at a constant speed, so that the etching time is easy to control, the etching solution is automatically injected, the output quantity of the etching solution is uniform and controllable, waste liquid is recycled while the etched quartz wafers are cleaned, and the cleaning effect and the waste liquid recycling efficiency are improved.

Description

technical field [0001] The invention relates to the field of quartz wafer production equipment, in particular to a special etching equipment for quartz wafer production and a method for using the same. Background technique [0002] When the quartz wafer is subjected to the wet etching process, the quartz wafer is first placed in the etching solution, and then after a period of time, the quartz wafer is placed in the cleaning solution for cleaning. The labor intensity of the staff is increased during the transfer process. On the other hand, the contact time between the etching solution and the quartz wafer is difficult to control, so it is often difficult to control the etching depth. After the etching is completed, the quartz wafer is cleaned with a cleaning solution. When it is difficult to recycle the mixed waste liquid, it is difficult to recycle the cleaning solution and etching solution. In view of this, we propose a special etching equipment for quartz wafer production...

AI Technical Summary

Problems solved by technology

[0002] When the quartz wafer is subjected to the wet etching process, the quartz wafer is first placed in the etching solution, and then after a period of time, the quartz wafer is placed in the cleaning solution for cleaning. The labor intensity of the staff is increased during the transfer process. On the other hand, the contact time between the etching solution and the quartz wafer is difficult to control, so it is often difficult to control the etching depth. After the etching is completed, the quartz wafer is cleaned with a cleaning solution. When the mixed waste liquid is difficult to recycle, it is difficult to recycle the cleaning solution and etching solution. In view of this, we propose a special etching equipment for quartz wafer production and its use method

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