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Photoelectric product packaging production method based on periodic array arrangement

A technology for array arrangement and optoelectronic products, applied in circuits, electrical components, electrical components, etc., can solve problems such as low packaging production efficiency, improve packaging production efficiency, reduce investment in fixed assets and operators, and improve utilization. Effect

Inactive Publication Date: 2020-07-28
杭州洛微科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a method for packaging production of optoelectronic products based on periodic array arrangement to solve the problem of low production efficiency of existing optoelectronic product packaging

Method used

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  • Photoelectric product packaging production method based on periodic array arrangement
  • Photoelectric product packaging production method based on periodic array arrangement
  • Photoelectric product packaging production method based on periodic array arrangement

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Embodiment Construction

[0032] The following description is only for disclosing the present invention to enable those skilled in the art to practice the present invention. The embodiments in the following description are only examples, and those skilled in the art can think of other obvious modifications. The basic principles of the invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and others without departing from the spirit and scope of the invention.

[0033] The invention provides a photoelectric product packaging production method based on periodic array arrangement, which can greatly improve the photoelectric product packaging production efficiency. Specifically, the periodic array arrangement-based optoelectronic product packaging production method includes the following steps:

[0034] The PCB board arrangement step is to manufacture a plurality of PCB boards 13 arranged in a periodic array according to predetermined spe...

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Abstract

The invention provides a photoelectric product packaging production method based on periodic array arrangement. The method comprises steps that firstly a plurality of PCBs are manufactured in periodicarray arrangement according to a preset specification, each single PCB is made to form a unit block, and the different unit blocks are made to form connecting ribs for interconnection; a plurality ofplastic upper covers which are arranged in a periodic array are manufactured according to the arrangement specification of the PCBs; then, the arranged PCBs are integrally attracted and limited on asurface of a production tool, so deformation and displacement of the PCBs are avoided; then, different photoelectric devices and the plastic upper cover are sequentially mounted on the arranged PCBs in a classified mode through automatic surface mounting equipment; and finally, the surface-mounted PCB is cut into single photoelectric products by using cutting equipment. The method is advantaged inthat the packaging production technological process can be simplified, the one-time output rate of packaging equipment is increased, the utilization rate and packaging production efficiency of the packaging equipment are improved, fixed assets and operator investment of enterprises are reduced, and investment cost of the enterprises is effectively reduced.

Description

technical field [0001] The invention relates to the field of optoelectronic product packaging, in particular to a production method for optoelectronic product packaging based on periodic array arrangement. Background technique [0002] SIP packaging (System In Package) integrates multiple functional active or passive devices, such as MEMS or light sources, lenses, processors, memories, sensor chips, etc., into one packaging unit to form a complete function This packaging method has the characteristics of small size, low energy consumption, multiple functions, high speed, and high compatibility. With the demand for miniaturization, high integration, large-scale production and use of consumer electronics, automotive and medical electronics, and wearable products, higher efficiency and lower cost production requirements are put forward for SIP packaged products. [0003] Optoelectronic products based on SIP packaging are affected by the physical characteristics of raw material...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H01L25/00H01L25/16
CPCH01L25/167H01L25/50H05K13/046H05K13/0469
Inventor 屈永强孙笑晨杨石泉刘飞陈绍卫
Owner 杭州洛微科技有限公司
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