Chip package
A chip packaging and chip technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of increasing the PCBA processing process and the difficulty of QFN repair.
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Embodiment 1
[0053] Such as image 3 As shown, a chip package is provided, including a pad 10, a chip 20, a package body 30 and a thermally deformable member 40, and the pad 10 includes a heat dissipation pad 11 and electrode contact pads arranged around the heat dissipation pad 11 12; the chip 20 is attached to the upper surface of the heat dissipation pad 11, and is electrically connected to the electrode contact pad 12; the package body 30 covers the sealing pad 10 and the chip 20, and the lower surface of the pad 10 is exposed to the package body 30 Surface; the thermally deformable member 40 is thermally deformed when heated, and is disposed on the package body 30 , and the thermally deformable member 40 and the bonding pad 10 are respectively disposed on two sides of the chip 20 .
[0054] In this example, if image 3 As shown, the thermally deformable member 40 is completely encapsulated inside the package body 30 . The chip 20 is selected as a silicon chip, which is connected to ...
Embodiment 2
[0057] Such as Figure 4 As shown, a chip package is provided, including a pad 10, a chip 20, a package body 30 and a thermally deformable member 40, and the pad 10 includes a heat dissipation pad 11 and electrode contact pads arranged around the heat dissipation pad 11 12; the chip 20 is attached to the upper surface of the heat dissipation pad 11, and is electrically connected to the electrode contact pad 12; the package body 30 covers the sealing pad 10 and the chip 20, and the lower surface of the pad 10 is exposed to the package body 30 Surface; the thermally deformable member 40 is thermally deformed when heated, and is disposed on the package body 30 , and the thermally deformable member 40 and the bonding pad 10 are respectively disposed on two sides of the chip 20 .
[0058] In this example, if Figure 4 As shown, the thermally deformable member 40 of this embodiment is disposed outside the package body 30 . The chip 20 is selected as a silicon chip, which is connec...
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