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A fpc surface glue device

A technology of glue sticking device and mounting board, which is applied in the directions of printed circuit, electrical components, printed circuit manufacturing, etc., can solve the problems of low sticking efficiency, scrapped PSA, sticking, etc., to improve sticking efficiency, avoid bending, fold, stick Glue position is accurate

Active Publication Date: 2021-10-26
GEER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the PSA structure in the prior art can only process a small number (such as 4) of individual FPCs at the same time. If the number continues to increase, the material will easily bend and wrinkle due to the increase in the area of ​​the PSA. Pasting occurs, causing the entire PSA to be scrapped
Moreover, in the prior art, the entire FPC board must first be divided into boards, and then each individual FPC board must be subjected to PSA attachment processing, the process flow is relatively cumbersome, and the attachment efficiency is low.

Method used

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  • A fpc surface glue device
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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] Please refer to figure 1 , figure 2 , image 3 and Figure 4 , figure 1 It is a schematic diagram of the overall structure of a specific embodiment provided by the present invention, figure 2 It is a schematic diagram of the installation structure of the FPC board a and the PSA board b on the installation board 1 and the flip board 2, image 3 for figure 1 The schematic diagram of the structure of the turnover plate 2 shown in the closed state, ...

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Abstract

The invention discloses an FPC surface gluing device, comprising a mounting plate for positioning and installing a whole FPC board, and a flipping plate that is reversibly connected to the mounting plate and used for positioning and installing a PSA board, the mounting plate and The surface of the flipping plate is provided with a number of suction holes for negative pressure adsorption on the FPC board and the PSA board respectively, and the flipping plate is turned over until it is attached to the surface of the mounting plate. When making described PSA board and described FPC board stick. In this way, through the function of each suction hole, when the FPC board is installed on the surface of the installation board, the FPC board can be fully extended through the negative pressure suction to avoid curling and bending; at the same time, when the PSA board is installed on the surface of the flip board When it is on the surface, the surface of the PSA board can be kept flat by negative pressure suction to prevent bending and wrinkling. Therefore, the efficiency of gluing on the surface of the FPC can be improved, and at the same time, the bending and wrinkling of the PSA during the attaching process can be avoided to ensure that the gluing position is accurate.

Description

technical field [0001] The invention relates to the technical field of SMT, in particular to an FPC surface gluing device. Background technique [0002] With the development of electronic technology, more and more electronic devices have been widely used. [0003] Cable is also called flexible printed circuit board (FPC, Flexible Printed Circuit), which stipulates the wiring rules, line sequence, line color, line number, etc. The data cables connecting the internal motherboard to the hard disk and optical drive, the data cables connecting the mobile phone motherboard to the display, and the data cables connecting devices are collectively referred to as flat cables. [0004] At present, the method of pasting PSA (pressure sensitive adhesive, pressure sensitive adhesive) on small FPCs is generally to divide the whole board of FPC into independent single FPCs with a sub-board machine, and then paste the PSA, because the PSA and Flex paste Together there are precision requirem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/38
CPCH05K3/00H05K3/38
Inventor 李大路
Owner GEER TECH CO LTD
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