Double-component condensed type encapsulating material convenient for construction and preparation method thereof

Abstract

The invention provides a double-component condensation type encapsulating material convenient for construction. The mixing ratio of a component A to a component B is (4-6): 1. The component A is prepared from the following main raw materials in parts by mass: 100 parts of alpha, omega-dihydroxy polydimethylsiloxane, 0-50 parts of a plasticizer, 50-150 parts of a flame retardant, 10-150 parts of aheat conduction filler and 10-100 parts of other fillers. The component B comprises the following main raw materials in parts by mass: 0.1-5 parts of a catalyst, 100 parts of polyether and 20-100 parts of a cross-linking agent composition, and the component B does not contain linear dimethyl silicone oil or branched chain type dimethyl silicone oil. The viscosity difference multiple of the component A and the component B can be controlled within the range of 5, so that the good matching performance of the pouring sealant and equipment is ensured, the proportional fluctuation of materials during gluing is reduced, and the pouring qualification rate of parts is increased.

Description

technical field [0001] The invention belongs to the technical field of organosilicon materials, and in particular relates to a two-component condensation type potting material which is convenient for construction and a preparation method thereof. Background technique [0002] With the rapid development of science and technology, electronic components tend to be miniaturized and integrated, and their heating power during operation also increases significantly, which puts higher requirements on the performance of potting compounds. Currently commonly used potting adhesives include epoxy resin and silicone materials, but epoxy resin has poor resistance to high temperature and humidity, which shortens the service life of components, or causes short circuits when water vapor enters the interior of the components. Silicone materials are widely used in the coating or potting of electronic products because of their good shockproof, moisture-proof, high and low temperature resistance...

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Problems solved by technology

The above patents involve the use of two-component condensation-type potting adhesives for potting and protection of electronic products or solar energy industries, which can meet the basic requirements of the market for two-component condensation-type potting adhesives, but in the face of the current trend of increasingly complex electronic products , there are still many technical problems to be solved, such as: 1) The viscosity difference between the two components of the condensation type two-component potting glue in the market is generally large, and the two-component glue machine needs to be complicated and debugged when using it. This increases the difficulty of the user in construction, and the matching stability between the potting compound and the gluing equipment decreases, resulting in an increase in the fluctuation range of the mixing ratio of the user during the gluing process, resulting in unstable quality after curing; 2)B The storage stability of the component is not high, usually within less than two months of storage, the curing speed of component B will drop to half of the initial value; 3) Ordinary potting adhesives pursue higher fluidity, but the market There are gaps in the design of many electronic components or equipment shells in the world, and the use of ordinary high-fluidity potting glue will lead to easy leakage of glue and lead to a low pass rate of glue

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