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OLED display panel and electronic equipment

A display panel and display area technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as easy cracking of the packaging structure, research on OLED display panels to be infiltrated, and affecting Frit packaging effects, etc.

Active Publication Date: 2020-06-12
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, such a packaging structure is particularly prone to cracking, which seriously affects the packaging effect of Frit, and the OLED device will come into contact with external water vapor and oxygen, which will cause the OLED device to fail and display abnormalities.
[0003] Therefore, research on OLED display panels remains to be penetrated into

Method used

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  • OLED display panel and electronic equipment
  • OLED display panel and electronic equipment
  • OLED display panel and electronic equipment

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Embodiment Construction

[0011] Embodiments of the present application are described in detail below. The embodiments described below are exemplary and are only used for explaining the present application, and should not be construed as limiting the present application. If no specific technique or condition is indicated in the examples, it shall be carried out according to the technique or condition described in the literature in this field or according to the product specification.

[0012] In one aspect of the present application, the present application provides an OLED display panel, the OLED display panel has a display area and a packaging area, according to an embodiment of the present application, refer to figure 1 , the OLED display panel includes: a first substrate 10 and a second substrate 20, the first substrate 10 and the second substrate 20 are arranged oppositely; an inorganic insulating film 30, the inorganic insulating film 30 is arranged on the first substrate 10 close to the second s...

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Abstract

The invention provides an OLED display panel and electronic equipment, the OLED display panel is provided with a display area and a packaging area, the OLED display panel comprises a first substrate and a second substrate, wherein the first substrate and the second substrate are oppositely arranged; an inorganic insulating film arranged on the surface, close to the second substrate, of the first substrate and covering the display area, wherein the outer edge of the inorganic insulating film is located in the packaging area; a heat conduction layer arranged around the outer edge of the inorganic insulating film; a frame sealing glue located in the packaging area, located between the inorganic insulating film and the second substrate and covers the side wall, away from the display area, of the heat conduction layer. Therefore, when static electricity is generated outside; heat generated by static electricity cannot be quickly transferred to the inorganic insulating film; when the OLED device is packaged, the heat is firstly transferred to the heat conduction layer and is rapidly dispersed, and the heat is greatly reduced when the heat is transferred to the inorganic insulating film,so that the inorganic insulating film is protected, the problem of damage to the inorganic insulating film is avoided, the packaging quality is greatly improved, and water and oxygen are prevented from permeating into the OLED device.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, and in particular, relates to OLED display panels and electronic equipment. Background technique [0002] In the hard-screen OLED display, in order to protect the OLED device from the influence of water vapor and oxygen in the external environment, glass glue (Frit) is used for encapsulation. Such as figure 1 , in the manufacturing process, the glass glue Frit will be coated on the upper substrate first, then the upper and lower substrates will be bonded together, and then the Frit will be melted and sintered with a laser, so that the upper and lower substrates will be bonded together through the Frit. figure 1 The cross-sectional view on the right is the conventional structure of the existing models on the market. The reason why the metal layer is needed under the Frit is that the metal layer can reflect the energy of the laser, which will make the sintering uniformity an...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L27/32H01L23/367H01L27/02
CPCH01L27/0296H01L23/367H10K59/12H10K50/8426
Inventor 鲁佳浩
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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