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Blind hole-filling electroplating process, plated part obtained according to process, application of plated part, and electronic product

An electroplating process and blind hole technology, applied to electrical components, circuits, printed circuits, etc., can solve problems such as long time, difficult supply of metal ions, copper thickness of copper plating surface, etc., to avoid core and missing filling, improve Distributed across the board, avoiding the effect of filling holes

Active Publication Date: 2020-06-12
东莞市康迈克电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For the above two types of hole types, DC (waveform) electroplating is currently used to fill holes, but it shows certain limitations:
[0005] For blind holes with ordinary depth-to-diameter ratios, the currently used DC hole filling process is the most mature and stable, but the efficiency is low. If the holes are to be filled, the copper on the copper-plated surface is thicker and the time is longer (usually the thickness of copper plating ≥10um; the time is greater than 40 minutes), which is not conducive to the production of thin lines
[0006] For blind hole filling with high depth-to-diameter ratio, the biggest difficulty of DC electroplating is that the fluid exchange at the bottom of the blind hole is unfavorable. The deeper the hole, the less exchange of plating solution at the bottom, the more difficult it is to supply metal ions, and the lower the potential at the bottom. It is not conducive to the distribution and adsorption of additives, that is, the gloss agent at the bottom of the hole cannot form a high-density aggregation, so it cannot form a rapid explosion (Bottom-up) at the bottom of the hole, and it is easy to form skip plating and void quality question

Method used

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  • Blind hole-filling electroplating process, plated part obtained according to process, application of plated part, and electronic product
  • Blind hole-filling electroplating process, plated part obtained according to process, application of plated part, and electronic product
  • Blind hole-filling electroplating process, plated part obtained according to process, application of plated part, and electronic product

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0153] The preparation method of the leveling agent includes: taking 2g of N,N-dimethyl 1,4-butanediamine into a 50mL round-necked flask, then adding 5g of water into the flask, and stirring; placing the flask in an oil bath and fix it, install the condensing reflux tube on the flask; heat the oil bath to 95°C, then slowly add 2.45g of 1,7-octadiene diepoxide; Five hours; turn off the heat and continue stirring; cool to room temperature and collect the product, which is tan. Purify and dry the product to obtain a white powder, which is the leveling agent.

[0154] (c) Water washing of the test plate: two courses: the first course takes 3 minutes, and the second course takes 2 minutes.

[0155] (d) Drying of test panels.

[0156] (e) Cut the sample and make slices.

[0157] (f) Analyze slices, export data.

Embodiment 1

[0159] For blind vias with a diameter of 110 μm and a depth of 85 μm, pulse filling can effectively improve the efficiency of copper plating, which is 60% higher than that of DC electroplating.

[0160] The current density was 40ASF, and the total hole-fill plating time was 35 minutes. Select positive pulse waveform: that is, forward current 40ASF, no direction current (reverse direction current is 0); forward current time is 40 milliseconds, reverse time is 0; pause time (time when current is 0) is 4 milliseconds; There is no phase difference (phase is 0), that is, the waveforms of test boards A and B are synchronized; the electroplating time is 25 minutes with waveform 1; the electroplating time is 25 minutes for waveform 2, and the electroplating is continued for 10 minutes. The combined waveforms are shown in Table 1.

[0161] The slice picture after electroplating is as follows Figure 5 As shown, it can be seen that: 1. There is no void in the hole filling; 2. The depr...

Embodiment 2

[0166] For blind holes with relatively high depth and diameter (second-order blind holes filled once), the combination of positive and negative pulse waveforms is selected, and the combined waveforms are shown in Table 2.

[0167] Table 2

[0168]

[0169] The slice picture after electroplating is as follows Figure 6 As shown, it can be seen that: 1. There is no void in the hole filling; 2. The depression is less than 10 μm; 3. The copper plating thickness is 20 μm.

[0170] Figure 6 Among them, the hole diameter is 102.07 μm, the hole depth is 122.48 μm, and the hole filling depression is 7.02 μm.

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Abstract

The invention relates to the field of electroplating, in particular to provide a blind hole-filling electroplating process, a plated part obtained according to the process, application of the plated part, and an electronic product. The blind hole-filling electroplating process comprises the following step of filling a blind hole of the plated part through pulse electroplating, or filling the blindhole of the plated part through a combination of pulse electroplating and direct current electroplating. The process can effectively improve copper plating performance and efficiency and plating distribution: for blind holes with ordinary depth-to-diameter ratio, higher current density (improved from the previous 20ASF to 50ASF) is required in filling, the efficiency is improved, and the thickness of copper of a surface is reduced; bulging of filled holes is avoided, and the distribution of the whole board is improved; the blind hole-filling electroplating process is suitable for high-end HDItechnology; and for the filling of blind holes with high depth-to-diameter ratio, void and skip plating can be avoided, so that the quality of hole filling is improved.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a blind hole filling electroplating process, a plated part obtained by using the process, an application of the plated part, and an electronic product. Background technique [0002] As electronic products become more and more widely used, the demand for small and powerful integrated circuits and circuit boards is also increasing, and integrated circuits or circuit boards are usually provided with blind holes for interconnection of various layers. [0003] At present, there are two kinds of blind hole diameters: (1) Ordinary depth-to-diameter ratio blind holes: With the continuous miniaturization and more powerful functions of consumer electronics products, more and more layers of circuit boards are required, and more and more interlayers are required. The thinner it is, the smaller the line width / line spacing (L / S), and the smaller the diameter of the blind hole that acts as a conne...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/18H01L21/768H05K3/00
CPCC25D3/38C25D5/18H01L21/76879H05K3/0094
Inventor 张二航
Owner 东莞市康迈克电子材料有限公司
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