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High-bending-strength high-modulus light epoxy composite board and preparation method thereof

A flexural strength and high modulus technology, applied in the field of high flexural strength and high modulus lightweight epoxy composite panels and their preparation, can solve the problems of high cost and low flexural modulus, and achieve low cost and high flexural strength. Effect

Pending Publication Date: 2020-06-09
中科威禾科技(肇庆)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a high bending strength, high modulus lightweight epoxy composite board and its preparation method, aiming to solve the problems of bending strength, bending The problem of low modulus and high cost

Method used

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  • High-bending-strength high-modulus light epoxy composite board and preparation method thereof
  • High-bending-strength high-modulus light epoxy composite board and preparation method thereof

Examples

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Embodiment 1

[0032] Such as figure 1 As shown, take two sheets of FAW for 150g / m 2 , RC is 35% carbon fiber UD prepreg 11a, 11b, two FAW is 75g / m 2 , RC is 35% carbon fiber UD prepreg 12a, 12b, and a density of 0.72g / cm 3 , a lightweight epoxy board 13e with a thickness of 0.60mm, a carbon fiber UD prepreg 11a and a carbon fiber UD prepreg 12a, a carbon fiber UD prepreg 11b and a carbon fiber UD prepreg 12b in advance Stacked vertically at 0° / 90°, and then stacked with a lightweight epoxy board 13e, carbon fiber UD prepregs 11a, 12a and carbon fiber UD prepregs 11b, 12b are arranged on both sides of the lightweight epoxy board 13e , and relative to the lightweight epoxy board 13e, it is symmetrical in relative position and symmetrical in the UD direction. After stacking, add release film up and down, at a temperature of 170-200°C and a pressure of 10-30kg / cm 2 Under the condition of hot pressing for 150min, then at 5Kgf / cm 2 The pressure is cold pressed for 60 minutes to obtain a ligh...

Embodiment 2

[0034] Such as figure 2 As shown, take two sheets of FAW for 150g / m 2 , RC is 30% glass fiber UD prepreg 11c, 11d, two FAW is 65g / m 2 , RC is 30% glass fiber UD prepreg 12c, 12d, and a density of 0.8g / cm 3, a light weight epoxy board 13f with a thickness of 0.75mm, a piece of glass fiber UD prepreg 11c and a piece of glass fiber UD prepreg 12c, a piece of glass fiber UD prepreg 11d and a piece of glass fiber UD The prepregs 12d are stacked vertically at 0° / 90°, and then stacked with a lightweight epoxy board 13f, the glass fiber UD prepregs 11c, 12c and the glass fiber UD prepregs 11d, 12d are arranged in a light ring The two sides of the oxygen board 13f, and relative to the lightweight epoxy board 13f, are symmetrical in relative position and symmetrical in the UD direction. After stacking, add release film up and down, at a temperature of 170-200°C and a pressure of 10-30kg / cm 2 Under the condition of hot pressing for 150min, then at 5Kgf / cm 2 The pressure is cold pre...

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Abstract

The invention discloses a high-bending-strength high-modulus light epoxy composite board and a preparation method thereof. The high-bending-strength high-modulus light epoxy composite board is obtained by respectively and symmetrically arranging a plurality of UD prepregs on two sides of a light epoxy board in opposite positions and in the UD direction, superposing the prepregs, hot-pressing the prepregs and then cold-pressing the prepregs. According to the high-bending-strength high-modulus light epoxy composite board, the basic characteristics of a light epoxy board are reserved, the functions of insulation, supporting and the like are achieved, and the characteristics of high bending strength, high modulus, light weight and low cost are further achieved.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a lightweight epoxy composite board with high bending strength and high modulus and a preparation method thereof. Background technique [0002] As a large category of composite materials, epoxy board has good electrical insulation and mechanical properties, and has been widely used in insulation, support and other fields. Usually the epoxy board uses glass cloth, glass felt, paper, ceramics, etc. The pressure and temperature conditions are obtained by hot pressing and curing with a hot press. [0003] Lightweight epoxy board is a new type of epoxy board, which has good mechanical properties, good heat resistance, moisture resistance, good flatness, smooth surface, no pits, and standard thickness tolerance. Compared with ordinary cardboard, PC board, fiberboard is not easy to deform, its toughness is better, can play a certain role of support and reinforcement, after...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B9/04B32B17/02B32B17/10B32B27/12B32B27/38B32B37/06B32B37/10
CPCB32B5/02B32B5/26B32B27/12B32B27/38B32B37/06B32B37/10B32B2262/02B32B2307/546
Inventor 吴卫生罗文伟
Owner 中科威禾科技(肇庆)股份有限公司
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