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Colloid three-dimensional reconstruction and thickness measurement method and system based on spectral confocal

A spectral confocal and three-dimensional reconstruction technology, which is applied in the field of colloid three-dimensional reconstruction and thickness measurement, can solve the problems that are not suitable for intelligent batch real-time processing, the accuracy cannot meet the measurement requirements, and it is as high as ten microns. Good adaptability and improved processing speed

Active Publication Date: 2020-06-05
WUHAN INSTITUTE OF TECHNOLOGY
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Problems solved by technology

The height of the glued surface of the LED tape can be obtained by using the laser triangulation method, but because the width of the laser itself reaches more than ten microns, the error of the obtained data will be as high as ten microns, which cannot meet the measurement requirements; and because the line laser detection It is converted into a height value through the thickness of the light and the degree of protrusion. For transparent parts, it is easy to scatter and cause poor focusing effect, which will further affect the measurement accuracy.
Microscopic measurement can meet the measurement accuracy requirements, but the measurement process is cumbersome and is mainly done manually, which is not suitable for intelligent batch real-time processing

Method used

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  • Colloid three-dimensional reconstruction and thickness measurement method and system based on spectral confocal
  • Colloid three-dimensional reconstruction and thickness measurement method and system based on spectral confocal
  • Colloid three-dimensional reconstruction and thickness measurement method and system based on spectral confocal

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Embodiment Construction

[0058] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0059] see figure 1 , the colloid three-dimensional reconstruction and thickness measurement method based on spectral confocal of the present invention, comprises the following steps:

[0060] S1: Collect the distance data of the colloid to be measured through the colloid 3D reconstruction and thickness measurement system based on spectral confocal; the distance data is the light reflected by the colloid detected by the spectral confocal sensor of the colloid 3D reconstruction and thickness measurement system based on spectral confocal The distance between the focus of and the focus of the violet light reflected by the colloid:

[0061] S11: Assemble the spectral confocal sensor, three-axis mobile platform, point cloud module, point cloud data processing module and input and output module into a colloidal 3D reconstruction and thickn...

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Abstract

The invention provides a colloid three-dimensional reconstruction and thickness measurement method and system based on spectral confocal. The system comprises a spectral confocal sensor, a three-axismobile platform, a point cloud module, a point cloud data processing module and an input and output module. Nano-scale distance data of the glue coating colloid of awidget is acquired through spectralconfocal sensorin combination withthethree-axis mobile platform, and ordered three-dimensional point cloud data is formed through combination; invalid point correction, Z-axis overturning, pseudo-color mapping, gridding and smoothing are carried out on point cloud data, three-dimensional point cloud is updated, the distance between the focus of detected light and the focus of purple light is calculated, the function of visually measuring the thickness of needed widget colloid in real time is achieved, and through test verification, the measurement precision reaches the nanoscale.

Description

technical field [0001] The invention belongs to the technical field of high-precision measurement, and in particular relates to a colloid three-dimensional reconstruction and thickness measurement method and system based on spectral confocal. Background technique [0002] At this stage, with the miniaturization of equipment, the precision requirements for process manufacturing are getting higher and higher. In the current LED industry, the position and thickness of the batch glue application of LED tapes need to be strictly controlled, and the measurement accuracy needs to reach the nanometer level and be able to measure in real time. [0003] There are laser triangulation and microscope measurement methods for the measurement of micro parts. The height of the glued surface of the LED tape can be obtained by using the laser triangulation method, but because the width of the laser itself reaches more than ten microns, the error of the obtained data will be as high as ten mic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06G01B11/24
CPCG01B11/06G01B11/24
Inventor 洪汉玉石教炜章秀华赵卿松赵书涵王朋李兴珣徐洋洋
Owner WUHAN INSTITUTE OF TECHNOLOGY
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