Special-shaped sealed heat dissipation and conduction device

Abstract

The invention belongs to the technical field of heat dissipation devices, and discloses a special-shaped sealed heat dissipation and conduction device. The device comprises a heat dissipation element,a heat dissipation assembly and a sealing box, wherein the heat dissipation element and the heat dissipation assembly are both arranged in the sealing box, the heat dissipation assembly comprises a first heat dissipation copper plate, a heat pipe and a second heat dissipation copper plate, the heat dissipation end of the heat dissipation element is connected with one end of the first heat dissipation copper plate, the other end of the first heat dissipation copper plate is connected with one end of the heat pipe, and the other end of the heat pipe is connected with one end of the second heatdissipation copper plate; heat dissipation fins are arranged on the sealing box, and the second heat dissipation copper plate abuts against the heat dissipation fins. On the one hand, the size and themass of electronic equipment can be reduced; and on the other hand, the air duct design of the electronic product is simplified, the air resistance is reduced, and higher heat dissipation requirements are met by using the simplest structure. In addition, the manufacturing process of the product is simple, the cost is not increased, the dustproof and waterproof effects can be achieved more simply,and the IP grade required by the product can be better achieved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation devices, and in particular relates to a special-shaped sealed heat dissipation conduction device. Background technique [0002] With the rapid development of the computer industry and the trend of diversification of electronic devices, the efficacy of electronic equipment is gradually strengthening, and now production and life are inseparable from electronic equipment. Various electronic and electrical equipment on the market today, in the work Heat will be generated in any state, but the service life of electronic equipment will decrease exponentially with the increase of temperature. The heat dissipation effect of existing electronic and electrical equipment is not particularly ideal, and sometimes the temperature of electronic products is too high. The damage of electronic components and the service life of electronic equipment depend on the quality of heat dissipation. A good heat dis...

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Problems solved by technology

When there are many heat-generating surfaces of the heat-dissipating device: that is, a special-shaped structure, if this method is still used-place a radiator or heat pipe for each plane heat source, in order to maintain an excellent heat dissipation effect, the volume and quality of the product will be greatly reduced. At the same time, the increase in the complexity of the structure will make it more difficult to arrange the air ducts of the cooling system, which will increase the resistance of the airflow. Under the same convection cooling effect, the power of the fan must be increased, so that the electronic equipment Noise and energy consumption will further increase

[0004] There are also some irregular shaped heat sinks, which can complete the heat dissipation of such electronic components, but basically all the heating elements, heat conduction devices, and radiators are in one space, so it is difficult to achieve the IP level of electronic products. Design requirements

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