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Thermal visbreaking protective film and preparation method thereof

A composition and substance technology, applied in the field of thermal viscosity reduction protective film and its preparation, can solve the problems of difficult peeling strength, damage to components, etc., and achieve the effect of achieving adhesiveness, high adhesiveness and high peeling strength

Inactive Publication Date: 2020-06-02
广东硕成科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing technology has not yet achieved very good peelability, and damage to components still occurs from time to time, and it is not easy to achieve high peel strength during fixing, and to achieve a peeling effect without residual glue at non-high temperatures

Method used

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  • Thermal visbreaking protective film and preparation method thereof
  • Thermal visbreaking protective film and preparation method thereof

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preparation example Construction

[0030] The preparation method of above-mentioned thermal visbreaking composition is as follows:

[0031] Stir the expansion material and the solvent for 20-30 minutes first, then add the curing agent and acrylic material and stir for 20-30 minutes to obtain the product.

[0032] The second aspect of the present invention provides a thermal detackification protective film, which sequentially includes a substrate layer and a thermal detackification layer, wherein the thermal detackification layer is prepared from the thermal detackification composition.

[0033] In one embodiment, the thickness of the adhesive layer is 20-45 μm.

[0034] In one embodiment, the thickness of the substrate layer is 30-60 μm.

[0035] The base material layer of the present invention can be selected from the materials of those skilled in the art resin, such as but not limited to: low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random ...

Embodiment 1

[0038] Embodiment 1 of the present invention provides a thermal detackification protective film, comprising a substrate layer and a thermal detackification layer in sequence, wherein the thermal detackification layer is prepared from a thermal detackification composition; the thermal detackification composition comprises the following weight Parts of raw materials: 26 parts of acrylate, 21 parts of solvent, 5 parts of curing agent and 6 parts of expansion material;

[0039] The thermal visbreaking composition also includes a thermal initiator, and the content of the thermal initiator is 0.6 wt% of the acrylate monomer content;

[0040] Acrylic substances include polyacrylate substances and acrylate monomers; the weight ratio of polyacrylate substances and acrylate monomers is 0.12:1;

[0041] The acrylate monomers are hydroxyethyl acrylate, lauryl acrylate and 1,6-hexanediol diacrylate, and the molar ratio of hydroxyethyl acrylate, lauryl acrylate and 1,6-hexanediol diacrylate...

Embodiment 2

[0050] Embodiment 2 of the present invention provides a thermal detackification protective film, comprising a substrate layer and a thermal detackification layer in sequence, wherein the thermal detackification layer is prepared from a thermal detackification composition; the thermal detackification composition comprises the following weight Parts of raw materials: 44 parts of acrylate, 33 parts of solvent, 12 parts of curing agent and 12 parts of expansion material;

[0051] The thermal visbreaking composition also includes a thermal initiator, and the content of the thermal initiator is 2.8 wt% of the acrylate monomer content;

[0052] Acrylic substances include polyacrylate substances and acrylate monomers; the weight ratio of polyacrylate substances and acrylate monomers is 0.31:1;

[0053] The acrylate monomers are hydroxyethyl acrylate, lauryl acrylate and 1,6-hexanediol diacrylate, and the molar ratio of hydroxyethyl acrylate, lauryl acrylate and 1,6-hexanediol diacryla...

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Abstract

The invention relates to the related field of semiconductors, and more specifically provides a thermal visbreaking protective film and a preparation method thereof. The invention provides a thermal visbreaking composition, which comprises the following raw materials: an acrylate substance, a solvent, a curing agent and an expansion material, wherein the acrylate substance comprises a polyacrylatesubstance and an acrylate monomer, and the viscosity of the polyacrylate substance is less than 250mPa.s at 23DEG C. The thermal visbreaking protective film is prepared from the specific thermal visbreaking composition, the protective film obtained through the specific acrylate substance and the thermal expansion material can achieve high peel strength before heat treatment, high adhesiveness is achieved, meanwhile, residual-glue-free peeling can be achieved at a low temperature, the peel strength is low, and the protective film is very convenient to use in the actual use process.

Description

technical field [0001] The present invention relates to the relevant field of semiconductors, and more specifically, the present invention provides a thermal debonding protective film and a preparation method thereof. Background technique [0002] When processing small components such as plastic parts, glass, metal plates, etc., it is usually necessary to use adhesive tape to assist in fixing to avoid damage caused by component movement during the cutting process. In addition, in etching, rinsing, or coating processes, when it is necessary to polish a part of the surface of a component, in order to protect other parts that do not need to be processed from being affected, tapes are also used to first cover the parts that do not need to be processed, and the parts to be processed Peel off when done. However, the adhesive strength of the tape used for fixing or covering needs to be strictly controlled. If the adhesive force is too strong, it is easy to damage the components wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/35C09J175/04
CPCC09J7/255C09J7/35C09J175/04C09J2203/326C09J2467/006
Inventor 柯跃虎诸葛锋曾庆明
Owner 广东硕成科技股份有限公司
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