A wafer multi-station edge polishing equipment

Abstract

The invention discloses a wafer multi-station edge polishing equipment, the structure of which comprises a fixed rod, a polishing system, a hydraulic cylinder, and a body. Two polishing systems are arranged on the top surface of the body, and a hydraulic cylinder is arranged directly above the polishing system. It is mechanically connected with the polishing system. There is a fixed rod on the top of the body. The polishing system includes an air inlet, a main rod, a folding cylinder, a fixed plate, and an operating platform. The operating platform is fixed directly above the machine body. The invention uses the mutual cooperation between the hydraulic cylinder, the main rod and the fixed plate to fix the wafer after the hydraulic cylinder is pressed down to prevent the relative sliding of the wafer when it is fixed. The invention cooperates with the fixed plate and the air inlet, etc., The wafer is adsorbed by means of air extraction, and the inner and outer rings are used to absorb and absorb the inside and outside of the wafer at the same time, so as to ensure that the wafer is evenly absorbed and will not break into two parts from the middle. Half.

Description

technical field [0001] The invention relates to the field of wafer cutting equipment, in particular to a wafer multi-station edge polishing equipment. Background technique [0002] The wafer is formed by slicing the whole ingot. With the shrinking of the parts of the electronic device, the application of the wafer on the electronic device is gradually increasing. For the surface granularity, geometric parameters, edge and surface roughness of the wafer, more and more requirements are proposed. Strict requirements require grinding and polishing of the edge of the wafer. When the wafer is fixed under pressure, the hardness is too high and it is easy to become brittle, causing the wafer being polished to be separated from the middle and split into two halves, resulting in a low polishing yield. Contents of the invention [0003] Aiming at the deficiencies of the prior art, the present invention is realized through the following technical solutions: a multi-station edge polish...

AI Technical Summary

Problems solved by technology

[0002] The wafer is formed by slicing the whole ingot. With the shrinking of the parts of the electronic device, the application of the wafer on the electronic device is gradually increasing. For the surface granularity, geometric parameters, edge and surface roughness of the wafer, more and more requirements are proposed. Strict requirements require grinding and polishing of the edge of the wafer. When the wafer is fixed under pressure, the hardness is too high and it is easy to become brittle, causing the wafer being polished to be separated from the middle and folded in half, and the polishing yield is low.

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