Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology for semiconductors and raw materials, applied in the field of power cable materials, can solve the problems of high cost and poor processing performance, and achieve the effects of reducing raw material costs, saving energy and simple preparation process
Inactive Publication Date: 2020-05-05
HUANGSHI SHENBO ELECTRIC CO LTD
View PDF0 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0003] The purpose of the present invention is to provide a PVC semiconductor material for the problem of poor processing performance of existing common semiconductor materials and high cost as a shielding material.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0020] A PVC semiconductor material, comprising the following raw materials in parts by weight:
[0027] In the preparation, the raw materials are prepared and successively subjected to mixing, banburying, double-roll mixing, cooling, drying, pelletizer, screening, magnetic separation, metering, and packaging.
Embodiment 2
[0029] A PVC semiconductor material, comprising the following raw materials in parts by weight:
[0035] In the preparation, the raw materials are prepared and successively subjected to mixing, banburying, double-roll mixing, cooling, drying, pelletizer, screening, magnetic separation, metering, and packaging.
Embodiment 3
[0037] A PVC semiconductor material, comprising the following raw materials in parts by weight:
[0043] In the preparation, the raw materials are prepared and successively subjected to mixing, banburying, double-roll mixing, cooling, drying, pelletizer, screening, magnetic separation, metering, and packaging.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention relates to a PVC semiconductor material, which comprises the following raw materials: 40-60 parts of PVC, 30-40 parts of acetylene black, 10-20 parts of DOP, 5-10 parts of a plasticizer,1-3 parts of lead stearate, 1-3 parts of lead sulfate, 1-5 parts of lead phthalate, 1-3 parts of calciumstearate, 2-10 parts of a flame retardant and 1-2 parts of an antioxidant. The semiconductor material is prepared by the following steps: preparing raw materials, mixing, banburying, carrying out double-roller milling, cooling, drying, granulating by a granulator, screening, carrying out magnetic separation, metering and packaging in sequence. Acetylene black is added into the PVC formula of the cable material, so that the volume resistivity of the material can reach 103 omega.cm, and thecable material has semi-conductive performance and can be used for manufacturing various shielding devices, and the cost of raw materials is greatly reduced.
Description
technical field [0001] The invention belongs to the technical field of power cable materials, in particular to a PVC semiconductor material. Background technique [0002] Semiconductor materials are a class of electronic materials with semiconductor properties (conductivity between conductors and insulators, resistivity in the range of about 1mΩ·cm~1GΩ·cm), which can be used to make semiconductor devices and integrated circuits. In addition, various shielding devices also need to use semiconductor materials, and ordinary semiconductor materials are hard materials, which are affected by the processing performance of raw materials when making various shielding devices, and the cost is high. It is also very good. Therefore, the development of a PVC semiconductor material to prepare shielding products will greatly reduce the raw material cost and processing cost of the product. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a PVC semicond...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more