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A method of testing photoresist resin components

A photoresist and resin technology, which is applied in the direction of weighing, analyzing materials, and measuring devices by removing certain components, can solve problems such as inability to analyze, difficult to dissolve resin, and displacement, so as to save solvent consumables and atlases Clear and easy-to-use effects

Active Publication Date: 2022-05-06
NINGBO NATA OPTO ELECTRONICS MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the analysis and testing methods for resin polymers mainly include NMR analysis, FTIR analysis, etc. NMR analysis can analyze the H and C content of the polymer structure, but the resin polymer needs to be dissolved in a special reagent, some resins are extremely difficult to dissolve, and photolithography The peaks of the monomers in the NMR spectrum of the glue polymer interact with each other and shift, and many peaks overlap. If the characteristic peaks of the polymer components overlap, it cannot be analyzed; FTIR infrared test analysis requires a lot of preparation work in the early stage, and the operation is more cumbersome.

Method used

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  • A method of testing photoresist resin components
  • A method of testing photoresist resin components
  • A method of testing photoresist resin components

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Experimental program
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Effect test

Embodiment 1

[0038] The methacrylate monomers A and B are polymerized by the method of the present invention according to the design molar ratio of the monomers being 50:50 to obtain a photoresist resin.

[0039] The numerical value of the photoresist was analyzed by nuclear magnetic resonance technology, and the hydrogen spectrum and carbon spectrum were obtained. It was found that the monomer peaks in the spectrum were easy to overlap or interfere with each other, and it was not easy to obtain the actual molar ratio of the monomer through the peak area.

[0040] Thermogravimetric analysis was performed on monomer A, monomer B, and photoresist values ​​respectively. The instrument used NETZSCH STA449F5 thermal analyzer (Shanghai Nachi Co., Ltd.), the test temperature was 500°C, the heating rate was 20k / min, and the nitrogen protection was 20ml / min ,get figure 1 , figure 2 with image 3 .

[0041] Depend on figure 1 , 2 It can be seen that monomer A begins to decompose at 200°C, and ...

Embodiment 2

[0050] The methacrylate monomers A and B are polymerized by the method of the present invention according to the design molar ratio of the monomers being 70:30 to obtain a photoresist resin.

[0051] The numerical value of the photoresist was analyzed by nuclear magnetic resonance technology, and the hydrogen spectrum and carbon spectrum were obtained. It was found that the monomer peaks in the spectrum overlapped with each other, and the actual molar ratio of the monomer could not be calculated by the peak area.

[0052] Thermogravimetric analysis was performed on monomer A, monomer B, and photoresist values ​​respectively. The instrument used NETZSCH STA449F5 thermal analyzer (Shanghai Nachi Co., Ltd.), the test temperature was 500°C, the heating rate was 20k / min, and the nitrogen protection was 20ml / min ,get Figure 4 , Figure 5 with Image 6 .

[0053] Depend on Figure 4 , 5 It can be seen that monomer A starts to decompose from 200°C, monomer B starts to decompose ...

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Abstract

The invention belongs to the field of photoresist resins, and in particular relates to a method for testing photoresist resin components, comprising the following steps: S1, dissolving the photoresist resin to be tested in a solvent, obtaining hydrogen spectra and Carbon spectrum; S2, analyze the hydrogen spectrum and the carbon spectrum, if the monomer peaks in the spectrum do not overlap each other, then get the molar ratio of each monomer in the photoresist resin according to the peak area, if the monomer peaks in the spectrum overlap with each other Overlap, then transfer to S3; S3, perform thermogravimetric analysis on the photoresist resin to be tested, and calculate the molar ratio of each monomer in the photoresist resin. The beneficial effect of the present invention is: when other test methods such as HNMR test, FTIR test will appear that the characteristic peaks overlap together, and the characteristic peaks cannot be distinguished. At this time, thermal analysis can be used as an accurate analysis method to analyze the photoresist resin components.

Description

technical field [0001] The invention belongs to the field of photoresist resins, in particular to a method for testing photoresist resin components. Background technique [0002] Photoresist resins are currently the key materials in the manufacture of advanced integrated circuits. The film-forming material of the photoresist is various photoresist resins, such as phenolic resin, methacrylic resin, and the like. Photoresist resin has excellent properties, such as high temperature resistance, corrosion resistance and so on. The photoresist resin is prepared by copolymerization of 1-4 functional monomers. Each functional monomer endows the photoresist with excellent application performance. With the miniaturization of components, the photolithographic patterns that need to be produced are getting smaller and smaller. The production of small-sized graphics requires photoresist and photoresist resin to control the proportion of each functional monomer. Generally, a certain feed...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20G01N5/04G01N24/08G01N33/44
CPCG01N25/20G01N5/04G01N33/442G01N24/087
Inventor 樊丹马潇顾大公毛智彪许从应
Owner NINGBO NATA OPTO ELECTRONICS MATERIAL CO LTD
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