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Composite stacked lcp substrate and preparation method

A composite and substrate technology, applied in the direction of circuit substrate materials, printed circuits, printed circuit components, etc., to achieve the effects of low thermal expansion coefficient, good bonding strength and mechanical properties, and low Dk/Df

Active Publication Date: 2020-09-15
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The previous patents only focused on the multilayer structure of the LCP substrate, or the addition of a toughening agent to improve the toughness of the LCP film. There is no previous example of using a multilayer structure to improve the water absorption and thermal expansion coefficient at the same time.

Method used

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  • Composite stacked lcp substrate and preparation method
  • Composite stacked lcp substrate and preparation method
  • Composite stacked lcp substrate and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0043] Implementation mode: a composite laminated LCP substrate, such as Figure 1 to Figure 2 As shown, it includes at least one copper foil layer 100, two low powder LCP layers 200, and a high powder LCP layer 300. The high powder LCP layer is located between the two low powder LCP layers. The copper foil The layer and the high-powder LCP layer are bonded by the low-powder LCP layer, and the content of the filler powder in the high-powder LCP layer is greater than that of the filler powder in the low-powder LCP layer Content, the low-powder LCP layer and the high-powder LCP layer both refer to LCP layers with a Dk value of 2.5-4.0 (10GHz) and a Df value of 0.001-0.005 (10GHz);

[0044] The thickness of each copper foil layer is 1-35 μm; the thickness of each low-powder LCP is 12-100 μm; the thickness of the high-powder LCP layer is 12-100 μm.

[0045] The low-powder LCP layer includes LCP and filler powder, the LCP is 70-100% (weight percentage) of the total solid content of the...

Embodiment approach 1

[0051] Embodiment 1: A composite laminated LCP substrate, such as figure 1 As shown, the LCP substrate is an LCP single-sided copper foil substrate, and the LCP single-sided copper foil substrate is composed of a copper foil layer 100, two low-powder LCP layers 200, and a high-powder LCP layer 300. The bottom is the copper foil layer 100, the low powder LCP layer 200, the high powder LCP layer 300, and the low powder LCP layer 200; the thickness of the LCP single-sided copper foil substrate is 37 -335μm.

[0052] The preparation method of the LCP single-sided copper foil substrate of Embodiment 1 is as follows:

[0053] Step 1: Coating the precursor of the low-powder LCP layer on one side of the copper foil layer, and removing the solvent at 60-180°C;

[0054] Step 2: Coating the precursor of the high-powder LCP layer on the lower surface of the low-powder LCP layer, and removing the solvent at 60-180°C;

[0055] Step 3. Coat the precursor of the low-powder LCP layer on the lower sur...

Embodiment approach 2

[0056] Embodiment 2: A composite laminated LCP substrate, such as figure 2 As shown, the LCP substrate is an LCP double-sided copper foil substrate. The LCP double-sided copper foil substrate is composed of two copper foil layers 100, two low-powder LCP layers 200, and a high-powder LCP layer 300. The bottom is the copper foil layer 100, the low powder LCP layer 200, the high powder LCP layer 300, the low powder LCP layer 200, and the copper foil layer 100; the LCP double-sided The thickness of the copper foil substrate is 38-370μm.

[0057] The preparation method of the LCP double-sided copper foil substrate of Embodiment 2 is one of the following two methods:

[0058] The first method includes the following steps:

[0059] Step 1. Coat the precursor of the low-powder LCP layer on one side of the copper foil layer, and remove the solvent at 60-180°C;

[0060] Step 2: Coating the precursor of the high-powder LCP layer on the lower surface of the low-powder LCP layer, and removing th...

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Abstract

The invention discloses a composite laminated LCP substrate, which comprises at least one copper foil layer, two low-powder LCP layers and a high-powder LCP layer, wherein the high-powder LCP layer ispositioned between the two low-powder LCP layers; the copper foil layer and the high-powder LCP layer are bonded through the low-powder LCP layer; the content of the filling powder in the high-powderLCP layer is greater than the content of the filling powder in the low-powder LCP layer; the low-powder LCP layer and the high-powder LCP layer are both LCP layers with the Dk value of 2.5-4.0 and the Df value of 0.001-0.005; the thickness of each copper foil layer is 1-35 mum; the thickness of each low-powder LCP is 12 to 100 mum; and the thickness of the high-powder LCP layer is 12-100 mum. According to the LCP substrate provided by the invention, the filling powder is added into the LCP layer, so that the prepared LCP substrate has the advantages of low water absorption, low thermal expansion coefficient, good bonding strength and good mechanical property.

Description

Technical field [0001] The invention relates to the technical field of FPC (flexible circuit board) and its preparation, and particularly relates to an LCP substrate. Background technique [0002] Flexible boards have the advantages of continuous automated production, increased wiring density, flexibility, large design fields, three-dimensional wiring, and the ability to omit connectors and wire welding. It meets the advantages of light, thin, short and multi-functional electronic products Demand, so that the application of soft board is increasing day by day. [0003] With the surge in high-frequency and high-speed transmission demand and the advent of the 5G era, the demand for high-performance engineering plastics has increased significantly. In the past, flexible copper foil substrates were made of copper foil and PI (polyimide) resin. However, PI film High electricity, easy to absorb moisture, easy to cause signal loss under high frequency and high speed transmission. Liquid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03
CPCH05K1/036H05K1/0373H05K2201/0141
Inventor 李建辉林志铭何家华
Owner KUSN APLUS TEC CORP
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