Design method of gold immersion process test board

Abstract

The invention discloses a design method of a gold immersion process test board. The design method comprises the following steps of: drilling a plurality of through holes in a core board, and metalizing the through holes through copper immersion and full-board electroplating; pasting a film on the core board, and forming a test pattern after exposure and development, wherein the test pattern comprises a plurality of circular PAD patterns and square blocky patterns, and carrying out windowing at the positions corresponding to the through holes; then plating a copper layer and a tin layer additionally through pattern electroplating; after film stripping, removing the board surface copper layer except the test pattern on the core board through etching, and then carrying out tin stripping; carrying out semi-hole-plugging processing on the partially metallized through hole; and manufacturing a solder mask layer on the core board to obtain the test board. The gold immersion process test boarddesigned by the method has the characteristics of normalization, standardization and unification, the gold immersion process can be scientifically evaluated, the product quality requirements of companies are met, and the quality risk, the cost risk and the management difficulty caused by selecting unqualified boards which are not suitable for the gold immersion process for testing are avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a design method of an immersion gold process test board. Background technique [0002] In the process of circuit board production, there is no standard and unified test board for the immersion gold process (mainly referring to the performance of the immersion nickel gold solution). The existing test methods generally use the staff to select the online production board or use the bare copper board to randomly select the solder mask. After the finished product follows the solder mask process, the immersion gold process is completed, and then the relevant performance is tested; however, the above test method has the following disadvantages: [0003] 1. There is no standard and no uniformity for the immersion gold process test board, and it is impossible to evaluate the pros and cons of the immersion gold process (mainly referring to the performance of the im...

AI Technical Summary

Problems solved by technology

[0003] 1. There is no standard and no uniformity for the immersion gold process test board, and it is impossible to evaluate the pros and cons of the immersion gold process (mainly referring to the performance of the immersion gold potion);

[0004] 2. The selection of the immersion gold process test board is unreasonable, and it cannot be guaranteed that it is completely suitable for the company's product process requirements

Images