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A Resin Plugging Method for Large Aperture Back Drilling

A technology of resin plugging and back drilling, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., and can solve problems such as hole depression, inability to make plug holes, and lack of fullness

Active Publication Date: 2020-10-27
珠海崇达电路技术有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the above-mentioned existing technical defects, the present invention provides a large-diameter back-drilled resin plugging method, which solves the quality problems such as the conventional resin plugging process that cannot be made or the plugging hole is hollow, not full, and the hole is depressed, and ensures that the resin plug The pores are full, and the pore depression is less than 30μm

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0029] A method for manufacturing a circuit board shown in this embodiment, which can produce a large-diameter resin plug hole with good quality, includes the following processing steps in sequence:

[0030] (1) Cutting: Cut out the core board and auxiliary light board according to the panel size 520mm×620mm. The thickness of the core board is 0.35mm (excluding the thickness of the outer copper layer), and the thickness of the copper layer on both surfaces of the core board is 1OZ.

[0031] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the film thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grid exposure ruler) to complete the exposure of the inner layer circuit; inner layer etching, etch out the inner layer circuit on the core board after exposure and development, and measure the inne...

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Abstract

The invention discloses a resin hole-plugging method for a large-aperture back-drilled hole, and the method comprises the following steps: drilling a through hole on a production plate, wherein one surface of the production plate is a back-drilled surface, and the other surface is a non-back-drilled surface; metalizing the through hole through copper deposition and full-board electroplating in sequence; performing back drilling at the position, corresponding to the metallized through hole, in the back-drilled surface through a depth-controlled drilling method, and forming a stepped back-drilled hole, wherein the hole diameter of the back-drilled part is larger than that of the through hole; filling resin in the back-drilled hole in a vertical vacuum hole-plugging manner and performing curing; filling resin into the back-drilled hole for the second time in a horizontal vacuum hole-plugging manner and curing; and removing the resin protruding out of the plate surface through an abrasivebelt grinding plate. According to the method, the quality problems that a conventional resin hole-plugging process cannot be used for manufacturing or hole plugging cavities, holes are not full, and hole openings are sunken are solved, full resin hole plugging is ensured, and hole opening sunken parts are less than 30 microns.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a resin plugging method for large-diameter back-drilled holes. Background technique [0002] PCB back-drilling is a through-hole after electroplating, using the depth-controlled drilling method to remove part of the hole copper and only retain a part of the hole copper. The key role of back-drilling is in the process of high-speed signal transmission. Reduce the reflection interference of redundant hole copper to the signal to ensure the integrity of signal transmission. At present, back drilling is a relatively low-cost manufacturing method that can meet the performance of high-frequency and high-speed circuit boards. [0003] In recent years, the density of printed boards has continued to increase, and the planar density of the originally shrinking aperture, line width, and line spacing tends to be a bottleneck, and increasing the three-dimensional den...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0094H05K2203/085H05K2203/1476
Inventor 寻瑞平张华勇戴勇杨勇
Owner 珠海崇达电路技术有限公司
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