Reflow welding process simulation model correction method based on heating factor

Abstract

The invention discloses a reflow welding process simulation model correction method based on a heating factor. The method comprises the following steps: establishing a numerical simulation correctionmodel which takes minimization of the time difference between a heating factor and a hyperliquidus as an optimization target and takes temperature of a temperature zone and a convective heat transfercoefficient as optimization variables by analyzing the time difference between the heating factor and the hyperliquidus of actually measured temperature data and corresponding numerical simulation temperature data; optimizing the model by adopting a response surface method and a multi-objective genetic optimization algorithm method, so that the result of the numerical simulation model is consistent with the actually measured temperature, the corrected numerical simulation model is obtained, and the accuracy of subsequent simulation prediction can be improved through feedback adjustment of one-time physical test. According to the method, the reflow welding process simulation model is corrected by a method of combining finite element simulation and tests, so that the simulation efficiency and precision are effectively improved.

Description

technical field [0001] The invention belongs to the technical field of reflow soldering process simulation finite element model correction, and in particular relates to a heating factor-based reflow soldering process simulation model correction method. Background technique [0002] With the rapid development of the integrated circuit industry, high integration and high reliability have become a new trend in the industry. Driven by this trend, Surface Mounted Technology (SMT) for electronic circuits has opened up broad prospects for the further miniaturization, thinning and lightweighting of electronic products, especially aerospace and military electronic equipment. Reflow (reflow) soldering is a key process in the surface mount technology (SMT) production process. The reflow soldering process directly affects the soldering quality and reliability of electronic products. At present, the method of "temperature measuring plate test - process parameter adjustment" is generall...

AI Technical Summary

Problems solved by technology

According to the solder joint temperature data obtained from the test, the simulation model of the reflow soldering process temperature field is corrected to obtain a more accurate process temperature field simulation model, which solves the problem of inaccurate simulation of the reflow soldering process temperature field model

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