Cleaning type metal surface treatment device

Abstract

The invention relates to a cleaning type metal surface treatment device, and belongs to the technical field of metal surface treatment. The device comprises a plating bath, a cleaning assembly is arranged on the inner side of the plating bath, and the cleaning assembly comprises a cleaning frame, a cleaning brush and a plurality of liquid discharge pipes. The cleaning frame is in a frame shape matched with the shape of the plating bath, the cleaning brush is fixedly connected to the middle of the side face, facing the inner wall of the plating bath, of the cleaning frame, and the cleaning brush is horizontally arranged. The top and the bottom of the side face, facing the inner wall of the plating bath, of the cleaning frame are fixedly connected with baffles, and the end faces, facing theinner wall of the plating bath, of the baffles are provided with liquid discharge grooves. The liquid discharge grooves communicate with the liquid discharge pipes, and the liquid discharge pipes communicate with a vacuum pump. The device has the plating bath cleaning effect without stopping production.

Description

technical field [0001] The invention relates to the technical field of metal surface treatment, in particular to a clean metal surface treatment device. Background technique [0002] At present, metal surface treatment is the process of plating a thin layer of metal or alloy on the surface of some metals by using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other materials to prevent metal Oxidation (such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and improve appearance. The specific process is: after the voltage is input between the anode and the cathode, the metal ions in the electroplating solution are attracted to swim to the cathode, and after reduction, they are plated on the plated object connected to the cathode, and the metal connected to the anode is redissolved at the same time, providing electroplating More...

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned existing technical solutions have the following defects: the impurities at the bottom of the plating tank can be filtered out, but after the plating tank has been used for a long time, some finer impurities will adhere to the inner wall of the plating tank, and these impurities are not easy to sink to the bottom of the plating tank. The bottom is drawn out and filtered out, and the plating tank needs to be cleaned manually manually, and the manual cleaning of the plating tank needs to be stopped for cleaning. Greater impact

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